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MC74HC240ADWR2G

Onsemi

MC74HC240ADWR2G by Onsemi

MC74HC240ADWR2G by Onsemi is a 20-terminal bus driver with 24ns propagation delay and 120ns tpd. It operates at -55 to 125 °C, suitable for military-grade applications requiring inverted output polarity and 3-STATE output characteristics. The small outline package with matte tin finish is ideal for surface mount designs in electronic systems.

Median Price

$0.348

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,220 parts In-Stock

1+ parts

$0.199

100+ parts

-

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10k+ parts

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5,220

$0.199

-

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Mouser Electronics

USA . 1,339 parts In-Stock

1+ parts

$0.610

100+ parts

$0.347

1k+ parts

$0.314

10k+ parts

$0.273

1,339

$0.610

$0.347

$0.314

$0.273

DigiKey

USA . 1,930 parts In-Stock

1+ parts

$0.650

100+ parts

$0.359

1k+ parts

$0.307

10k+ parts

$0.280

1,930

$0.650

$0.359

$0.307

$0.280

Rochester

USA . 53,321 parts In-Stock

1+ parts

-

100+ parts

$0.348

1k+ parts

$0.289

10k+ parts

$0.257

53,321

-

$0.348

$0.289

$0.257

Verical

USA . 21,780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.704

10k+ parts

$0.627

21,780

-

-

$0.704

$0.627

Chip1Stop

Japan . 1,272 parts In-Stock

1+ parts

-

100+ parts

$0.250

1k+ parts

$0.241

10k+ parts

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1,272

-

$0.250

$0.241

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Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.215

10k+ parts

$0.205

1,000

-

-

$0.215

$0.205

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,476 parts In-Stock

1+ parts

$0.154

100+ parts

-

1k+ parts

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10k+ parts

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1,476

$0.154

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-

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Component Electronics Inc.

Canada . 8 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

10k+ parts

-

8

$0.770

$0.580

$0.500

-

Flip Electronics

USA . 10,000 parts In-Stock

1+ parts

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10,000

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NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.430

10k+ parts

$0.391

2,000

-

-

$0.430

$0.391

Vyrian

USA . 1,953 parts In-Stock

1+ parts

-

100+ parts

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1,953

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IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.316

10k+ parts

$0.288

1,000

-

-

$0.316

$0.288

Prism Electronics

USA . 566 parts In-Stock

1+ parts

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566

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Speed Components Ltd

Israel . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,846 parts In-Stock

1+ parts

$0.146

100+ parts

-

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1,846

$0.146

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Corohmni

South Africa . 238 parts In-Stock

1+ parts

$0.162

100+ parts

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238

$0.162

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RC Electronics

USA . 9,000 parts In-Stock

1+ parts

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100+ parts

$0.150

1k+ parts

$0.140

10k+ parts

$0.140

9,000

-

$0.150

$0.140

$0.140

QUARKTWIN TECHNOLOGY LTD

USA . 6,991 parts In-Stock

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6,991

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Kulean Microsystems

USA . 6,313 parts In-Stock

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6,313

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SupplyDigital Components

Austria . 5,555 parts In-Stock

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5,555

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A-Z Elektronik GmbH

Germany . 2,607 parts In-Stock

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2,607

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,903 parts In-Stock

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TANS Electronics

Latvia . 1,283 parts In-Stock

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1,283

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Perfect Parts

USA . 704 parts In-Stock

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704

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UHIMA Technologies

Türkiye . 410 parts In-Stock

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410

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Overview

Enhance your electronic projects with the MC74HC240ADWR2G by Onsemi, a top-of-the-line Bus Driver & Transceiver. Crafted from high-quality materials and boasting superior technology, this product offers unmatched performance and reliability. Perfect for a wide range of applications, it provides seamless operation and precise data transmission. Experience the value and benefits of Onsemi's exceptional engineering with the MC74HC240ADWR2G, delivering innovation and efficiency to every project. Elevate your designs with this versatile component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the bus driver and transceiver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 24 ns

The low propagation delay at nominal supply allows for fast signal transmission, making this product ideal for high-speed data communication applications.

Surface Mount: YES

Being surface mountable makes installation and integration of this bus driver and transceiver into existing circuits easy and efficient.

No. of Functions: 2

With multiple functions packed into one component, this product helps save space on the PCB and simplifies the overall circuit design.

Nominal Supply Voltage / Vsup (V): 3

Operating at a low supply voltage of 3V makes this bus driver and transceiver energy efficient and suitable for battery-powered devices.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures compatibility with a wide range of external components and helps maintain signal integrity during data transmission.

Power Supplies (V): 2/6

Supporting power supplies ranging from 2V to 6V provides flexibility in system design and compatibility with a variety of power sources.

Maximum I (ol): 6 Amp

The high maximum output current allows this bus driver and transceiver to drive strong signals, making it suitable for demanding applications.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 °C to 125°C ensures reliable performance in extreme environmental conditions.

Technology: CMOS

Utilizing CMOS technology results in low power consumption, high noise immunity, and fast switching speeds, making this product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers MC74HC240ADWR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC74HC240ADWR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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