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MC74ACT541M

Onsemi

MC74ACT541M by Onsemi

MC74ACT541M by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 5V, has a propagation delay of 8ns, and can handle load capacitance up to 50pF. Ideal for industrial applications requiring fast signal transmission in compact spaces due to its small outline package and dual terminal position.

Median Price

$0.214

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,122 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

2,122

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$0.225

$0.186

$0.166

Farnell

UK . 2,122 parts In-Stock

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-

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$0.203

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$0.203

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Digiode

USA . 2,220 parts In-Stock

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$0.175

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2,220

$0.175

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Vyrian

USA . 3,587 parts In-Stock

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3,587

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Electronic Expediters

USA . 81 parts In-Stock

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81

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Distributors (Availability)

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Corphita

USA . 305 parts In-Stock

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$0.166

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305

$0.166

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Corohmni

South Africa . 215 parts In-Stock

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$0.184

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215

$0.184

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Ampacity Inc.

Singapore . 2,072 parts In-Stock

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$0.340

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2,072

$0.340

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AZTECH Wire

Italy . 1,018 parts In-Stock

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$13.070

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$13.070

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Aztec Data Supply Inc.

USA . 328 parts In-Stock

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$29.430

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328

$29.430

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Component Stockers USA

USA . 249 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 7,472 parts In-Stock

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SupplyDigital Components

Austria . 5,916 parts In-Stock

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Argo Parts USA

USA . 4,584 parts In-Stock

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Problanco Electronics

Mexico . 2,832 parts In-Stock

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Continental Prestige Electronics

USA . 2,122 parts In-Stock

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$0.160

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Kulean Microsystems

USA . 1,796 parts In-Stock

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TANS Electronics

Latvia . 550 parts In-Stock

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Microchip USA

USA . 232 parts In-Stock

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Bastille Electronics

Australia . 90 parts In-Stock

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UHIMA Technologies

Türkiye . 14 parts In-Stock

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Overview

Enhance your electronic projects with the MC74ACT541M by Onsemi, a top-tier manufacturer known for delivering high-quality Bus Driver & Transceivers. With a fast propagation delay of 8.5ns and a low power consumption design, this product ensures efficient signal transmission in various applications. The MC74ACT541M offers customers value through its reliable performance, compact package design, and wide temperature range suitability. Upgrade your circuits today with the unmatched benefits and advantages that this versatile component brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to damage, ensuring longevity and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with commonly used power sources.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for high flexibility in controlling the output signal, enabling efficient bus management and control.

Technical Specifications

Bus Driver & Transceivers MC74ACT541M attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74ACT541M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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