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MC74ACT540MEL

Onsemi

MC74ACT540MEL by Onsemi

MC74ACT540MEL by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 5V, with a max I (ol) of 24A and propagation delay of 8.5ns. Ideal for industrial applications requiring inverted output polarity and dual terminal position in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,840 parts In-Stock

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Digiode

USA . 1,234 parts In-Stock

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AZTECH Wire

Italy . 56 parts In-Stock

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$13.500

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56

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SupplyDigital Components

Austria . 8,237 parts In-Stock

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Kulean Microsystems

USA . 8,210 parts In-Stock

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TANS Electronics

Latvia . 5,553 parts In-Stock

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Corphita

USA . 2,086 parts In-Stock

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Problanco Electronics

Mexico . 1,107 parts In-Stock

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Microchip USA

USA . 434 parts In-Stock

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Corohmni

South Africa . 375 parts In-Stock

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UHIMA Technologies

Türkiye . 136 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the MC74ACT540MEL by Onsemi. As a top-tier manufacturer in the industry, Onsemi delivers a high-quality Bus Driver & Transceiver that boasts unparalleled reliability and efficiency. Ideal for a wide range of applications, this product offers customers the advantage of fast propagation delay, low power consumption, and a compact design that fits perfectly into any project. Experience the value of superior performance and precision with the MC74ACT540MEL from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction makes the product durable and resistant to external elements, ensuring a longer lifespan.

Surface Mount: YES

The surface mount feature enables easy installation and saves space on the PCB, making it suitable for compact designs.

No. of Bits: 8

Having 8 bits allows for more data processing capabilities, making the product suitable for handling complex bus communication protocols.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with most systems and devices, making it a versatile choice.

Propagation Delay (tpd): 8.5 ns

The low propagation delay ensures fast signal transmission, making the product ideal for high-speed data communication applications.

Temperature Grade: INDUSTRIAL

With industrial-grade temperature range (-40 to 85 °C), the product can operate reliably in harsh environments, making it suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers MC74ACT540MEL attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74ACT540MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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