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MC74ACT273DTR2

Onsemi

MC74ACT273DTR2 by Onsemi

MC74ACT273DTR2 by Onsemi is an 8-bit latch with a 5V supply, 12ns propagation delay, and 125MHz max frequency. Ideal for industrial applications requiring positive edge triggering in a compact rectangular package with surface mount capability.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,000 parts In-Stock

1+ parts

$0.110

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$0.110

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$0.110

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35,000

$0.110

$0.110

$0.110

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Distributors (In-Stock)

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Digiode

USA . 1,278 parts In-Stock

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$0.104

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1,278

$0.104

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Elcom Components

USA . 3,119 parts In-Stock

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3,119

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R&J Components

USA . 3,053 parts In-Stock

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EMSNET

USA . 2,474 parts In-Stock

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Vyrian

USA . 2,079 parts In-Stock

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2,079

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Distributors (Availability)

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Corphita

USA . 84 parts In-Stock

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$0.099

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84

$0.099

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Corohmni

South Africa . 224 parts In-Stock

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$0.110

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224

$0.110

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AZTECH Wire

Italy . 1,041 parts In-Stock

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$10.360

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1,041

$10.360

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Component Stockers USA

USA . 735 parts In-Stock

1+ parts

$99.990

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735

$99.990

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Problanco Electronics

Mexico . 6,448 parts In-Stock

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TANS Electronics

Latvia . 6,085 parts In-Stock

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Kulean Microsystems

USA . 4,789 parts In-Stock

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SupplyDigital Components

Austria . 4,312 parts In-Stock

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UHIMA Technologies

Türkiye . 827 parts In-Stock

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827

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Microchip USA

USA . 148 parts In-Stock

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Overview

Transform your electronics projects with the MC74ACT273DTR2 by Onsemi, a high-quality latch and flip-flop component that offers unparalleled reliability and performance. Onsemi's reputation for excellence in manufacturing ensures that this product is built to last, making it perfect for a wide range of applications in various industries. Experience the value and benefits of this versatile component, providing customers with seamless integration and enhanced functionality. Upgrade your projects today with the MC74ACT273DTR2 from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic circuits.

No. of Bits: 8

Having 8 bits allows for more complex operations and calculations to be performed by the device.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of electronic systems.

Propagation Delay (tpd): 12 ns

With a low propagation delay, this latch/flip-flop can quickly respond to input signals, improving overall system performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability even in harsh environmental conditions.

Technical Specifications

Latches & Flip-Flops MC74ACT273DTR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

125000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

125 MHz

Trade Compliance

MC74ACT273DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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