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MC74ACT240M

Onsemi

MC74ACT240M by Onsemi

MC74ACT240M by Onsemi is a 20-terminal bus driver with 9.5ns propagation delay at 5V supply voltage. It features 3-STATE output and inverted polarity, suitable for industrial applications requiring fast signal transmission in compact spaces. The package is surface mountable and made of plastic/epoxy material, making it ideal for high-speed data communication systems.

Median Price

$0.314

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 945 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

945

-

$0.277

$0.230

$0.205

DigiKey

USA . 945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.350

10k+ parts

-

945

-

-

$0.350

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,419 parts In-Stock

1+ parts

$0.217

100+ parts

-

1k+ parts

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2,419

$0.217

-

-

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Vyrian

USA . 5,750 parts In-Stock

1+ parts

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5,750

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-

-

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DigiKey Marketplace

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.240

10k+ parts

-

1,320

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-

$0.240

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Prism Electronics

USA . 7 parts In-Stock

1+ parts

-

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7

-

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,721 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

-

1,721

$0.205

-

-

-

Corohmni

South Africa . 165 parts In-Stock

1+ parts

$0.228

100+ parts

-

1k+ parts

-

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165

$0.228

-

-

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Problanco Electronics

Mexico . 8,198 parts In-Stock

1+ parts

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8,198

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-

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Kulean Microsystems

USA . 4,216 parts In-Stock

1+ parts

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4,216

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SupplyDigital Components

Austria . 2,951 parts In-Stock

1+ parts

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2,951

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TANS Electronics

Latvia . 1,219 parts In-Stock

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1,219

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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303

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Perfect Parts

USA . 8 parts In-Stock

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8

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Overview

Enhance your electronic designs with the MC74ACT240M from Onsemi, a leading manufacturer in the industry. This high-quality bus driver & transceiver offers reliability and efficiency, making it ideal for a wide range of applications. With its advanced technology and robust construction, this product delivers exceptional performance, ensuring seamless operation. Experience the value and benefits of this versatile component, providing customers with reliable connectivity and enhanced functionality. Elevate your projects to new heights with the MC74ACT240M by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the bus driver & transceivers lightweight and durable, ideal for portable and rugged applications.

Propagation Delay At Nominal Supply: 9.5 ns

The low propagation delay ensures fast signal processing and communication, making this product suitable for high-speed data transmission.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage allows for compatibility with a wide range of systems and power sources.

Output Characteristics: 3-STATE

The 3-state output feature allows the bus driver & transceivers to disconnect from the bus line, reducing power consumption and enabling multi-drop configurations.

Technical Specifications

Bus Driver & Transceivers MC74ACT240M attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74ACT240M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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