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MC74AC541MG

Onsemi

MC74AC541MG by Onsemi

MC74AC541MG by Onsemi is a bus driver & transceiver with 8 bits and a propagation delay of 9 ns. It operates at a nominal voltage of 5V and can handle a max current of 12 Amp. This IC is commonly used in industrial applications due to its small outline package and enable low control type.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

7,000

-

$0.502

$0.417

$0.371

Verical

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

7,000

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,250 parts In-Stock

1+ parts

$0.391

100+ parts

-

1k+ parts

-

10k+ parts

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1,250

$0.391

-

-

-

Nova Conductors

Japan . 22 parts In-Stock

1+ parts

$0.461

100+ parts

-

1k+ parts

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22

$0.461

-

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Vyrian

USA . 8,493 parts In-Stock

1+ parts

-

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8,493

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DigiKey Marketplace

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,987 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

-

10k+ parts

-

6,987

$0.350

-

-

-

Corphita

USA . 1,123 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

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1,123

$0.371

-

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Corohmni

South Africa . 389 parts In-Stock

1+ parts

$0.412

100+ parts

-

1k+ parts

-

10k+ parts

-

389

$0.412

-

-

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Component Stockers USA

USA . 6,448 parts In-Stock

1+ parts

$0.420

100+ parts

$0.390

1k+ parts

$0.360

10k+ parts

-

6,448

$0.420

$0.390

$0.360

-

Bastille Electronics

Australia . 199 parts In-Stock

1+ parts

$0.461

100+ parts

$0.438

1k+ parts

$0.416

10k+ parts

$0.410

199

$0.461

$0.438

$0.416

$0.410

AZTECH Wire

Italy . 388 parts In-Stock

1+ parts

$12.640

100+ parts

-

1k+ parts

-

10k+ parts

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388

$12.640

-

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QUARKTWIN TECHNOLOGY LTD

USA . 9,321 parts In-Stock

1+ parts

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9,321

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Kulean Microsystems

USA . 7,734 parts In-Stock

1+ parts

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7,734

-

-

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Continental Prestige Electronics

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

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10k+ parts

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7,000

-

$0.357

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SupplyDigital Components

Austria . 5,361 parts In-Stock

1+ parts

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100+ parts

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5,361

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TANS Electronics

Latvia . 5,030 parts In-Stock

1+ parts

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5,030

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Problanco Electronics

Mexico . 3,298 parts In-Stock

1+ parts

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3,298

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Microchip USA

USA . 2,601 parts In-Stock

1+ parts

-

100+ parts

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2,601

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UHIMA Technologies

Türkiye . 697 parts In-Stock

1+ parts

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697

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Overview

Discover the MC74AC541MG, a high-quality Bus Driver & Transceiver by Onsemi. With its advanced technology and industrial-grade components, Onsemi ensures superior performance and reliability in every product. This versatile device is perfect for various applications, offering customers exceptional value and benefits. Its 8-bit design allows for efficient data transmission, while the true output polarity and 3-STATE capabilities enhance flexibility and control. Experience seamless connectivity and fast propagation with the MC74AC541MG. Trust Onsemi for top-notch quality and unmatched advantages.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product's plastic/epoxy package body material ensures durability and protection for the internal components, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply:

9 ns - The low propagation delay of 9 ns ensures fast and efficient signal transmission, improving the overall performance of the bus driver & transceivers.

Surface Mount:

YES - With surface mount capability, this product can be easily mounted on circuit boards, enabling streamlined installation and reducing required space.

No. of Functions:

1 - This bus driver & transceiver offers a single function in a compact package, simplifying the design and reducing complexity for the user.

Package Shape:

RECTANGULAR - The rectangular package shape allows for efficient utilization of space on the circuit board and facilitates easy integration into the system design.

No. of Bits:

8 - With 8 bits, this product provides a wide range of data transfer capabilities, making it suitable for various applications requiring high-speed and accurate data transmission.

Nominal Supply Voltage / Vsup (V):

5 - The 5V nominal supply voltage ensures compatibility with standard power supplies, making it compatible with a wide range of systems.

Load Capacitance (CL):

50 pF - The load capacitance of 50 pF enables effective signal integrity by properly matching the impedance of the bus, ensuring reliable data transmission.

Power Supplies (V):

3.3/5 - This bus driver & transceiver supports power supplies of both 3.3V and 5V, providing flexibility and compatibility with various systems and voltage requirements.

No. of Terminals:

20 - With 20 terminals, this product offers multiple connection points, enabling the integration of various input/output signals and contributing to system versatility.

Package Style (Meter):

SMALL OUTLINE - The small outline package style minimizes the physical footprint of the bus driver & transceiver, allowing for efficient space utilization and easy integration into compact systems.

Maximum I (ol):

12 Amp - The high maximum output current of 12 Amp allows for driving high-power loads, making it suitable for applications requiring heavy current handling capability.

Propagation Delay (tpd):

9 ns - The propagation delay of 9 ns ensures fast signal transmission, minimizing latency and improving system performance.

Maximum Operating Temperature:

85 °C - With a maximum operating temperature of 85°C, this product can withstand high-temperature environments, making it suitable for industrial applications.

Output Characteristics:

3-STATE - The 3-STATE output characteristics of this bus driver & transceiver provide flexibility by allowing the output to be set to high impedance, facilitating bus sharing and multi-master systems.

Minimum Operating Temperature:

40 °C - The minimum operating temperature of -40°C allows this product to operate reliably even in harsh cold environments, expanding its application range.

Terminal Finish:

NICKEL PALLADIUM GOLD - The nickel palladium gold terminal finish ensures good conductivity, corrosion resistance, and long-term reliability, making this product suitable for demanding environments.

Terminal Position:

DUAL - With a dual terminal position, this product offers additional flexibility in board layout and connection orientation, accommodating various system requirements.

No. of Ports:

2 - The two ports of this bus driver & transceiver allow for simultaneous bidirectional communication, enabling efficient data transfer between multiple devices or subsystems.

Maximum Seated Height:

2.05 mm - The low maximum seated height facilitates installation in slim or space-constrained applications, optimizing overall system design and reducing component interference.

Width:

5.275 mm - The compact width of 5.275 mm ensures efficient use of space on the circuit board, contributing to a more compact and streamlined system design.

Output Polarity:

TRUE - The true output polarity of this product ensures compatibility with systems that require accurate and consistent output signal polarity, making it suitable for various applications.

Minimum Supply Voltage (Vsup):

2 V - The minimum supply voltage of 2V allows this bus driver & transceiver to operate with low-power systems or in battery-powered applications, expanding its range of usability.

Peak Reflow Temperature °C:

260 - With a peak reflow temperature of 260°C, this product can withstand standard soldering processes, ensuring reliable and secure mounting during manufacturing.

Length:

12.575 mm - The length of 12.575 mm provides a space-efficient form factor, allowing easy integration into designs with limited available space.

Temperature Grade:

INDUSTRIAL - With an industrial temperature grade, this bus driver & transceiver is designed to operate reliably in harsh industrial environments, making it suitable for industrial automation and control applications.

Technology:

CMOS - The CMOS technology used in this product offers low power consumption, high noise immunity, and wide input/output voltage ranges, making it an excellent choice for power-sensitive applications.

Terminal Form:

GULL WING - The gull wing terminal form facilitates easy soldering and a reliable electrical connection, ensuring efficient and secure installation during assembly.

Packing Method:

RAIL - This product is packed using the rail method, providing ease of handling, transportation, and automated assembly during the manufacturing process.

Terminal Pitch:

1.27 mm - The terminal pitch of 1.27 mm allows for easy and precise connection with other components or printed circuit boards, simplifying the manufacturing and integration process.

Control Type:

ENABLE LOW - The enable low control type offers easy and efficient control of the bus driver & transceiver, allowing for seamless integration with the system's control logic and enabling precise data transmission.

Maximum Supply Voltage (Vsup):

6 V - The maximum supply voltage of 6V ensures compatibility with higher voltage systems, expanding the range of applications for this bus driver & transceiver.

Technical Specifications

Bus Driver & Transceivers MC74AC541MG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74AC541MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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