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MC33342DG

Onsemi

MC33342DG by Onsemi

MC33342DG by Onsemi is a VOLTAGE-MODE control POWER SUPPLY SUPPORT CIRCUIT with 760 kHz MAX SWITCHING FREQ, 0.05 A MAX OUTPUT CURRENT. It operates b/w -25 to 85 °C and supports input voltage range of 3-18 V. Ideal for power management applications in compact designs due to SMALL OUTLINE package style.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,002 parts In-Stock

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Digiode

USA . 172 parts In-Stock

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Nova Conductors

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Ampacity Inc.

Singapore . 622 parts In-Stock

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$3.500

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Aztec Data Supply Inc.

USA . 10 parts In-Stock

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$4.133

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AZTECH Wire

Italy . 465 parts In-Stock

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$16.999

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Continental Prestige Electronics

USA . 6,295 parts In-Stock

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Kulean Microsystems

USA . 6,191 parts In-Stock

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Microchip USA

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TANS Electronics

Latvia . 4,310 parts In-Stock

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Argo Parts USA

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Aranea Global

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Problanco Electronics

Mexico . 1,503 parts In-Stock

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Corphita

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Kepictronics

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SupplyDigital Components

Austria . 729 parts In-Stock

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UHIMA Technologies

Türkiye . 707 parts In-Stock

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Corohmni

South Africa . 373 parts In-Stock

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Overview

Unlock the power of efficient energy management with the MC33342DG by Onsemi. Designed for optimal performance and reliability, this Power Management IC offers customers a seamless experience in various applications. Onsemi's commitment to quality shines through in every aspect of this product, providing unmatched value and benefits to users. Improve your power supply support circuit with ease and precision using the MC33342DG, a game-changer in the world of power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this product lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on PCBs.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of space on the PCB.

No. of Terminals: 8

With 8 terminals, this power management IC provides multiple connection options for flexibility in circuit design.

Package Style: SMALL OUTLINE

The small outline package style offers a compact design for applications with limited space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environments.

Control Mode: VOLTAGE-MODE

The voltage-mode control technique allows for stable and efficient power regulation.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures the IC can function in cold conditions.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

The dual terminal position offers versatility in PCB layout and design.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a compact overall design of the circuit.

Width (mm): 3.9 mm

With a width of 3.9mm, this IC can fit into tight spaces on the PCB.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

This IC is specifically designed for power supply support circuits, making it an ideal choice for power management applications.

Nominal Input Voltage: 6 V

The 6V nominal input voltage supports a wide range of power supply requirements.

Peak Reflow Temperature: 260 C

The high peak reflow temperature ensures the IC can withstand the soldering process during assembly.

Length: 4.9 mm

The length of 4.9mm contributes to the overall compact design of the IC.

Maximum Switching Frequency: 760 kHz

The high maximum switching frequency allows for fast and efficient power regulation.

Maximum Output Current: 0.05 A

With a maximum output current of 0.05A, this IC can handle a variety of load requirements.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique offers precise control over the output voltage.

Switcher Config: SINGLE

The single switcher configuration simplifies the design and implementation of the power supply circuit.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this IC is compatible with standard PCB layouts.

Minimum Input Voltage: 3 V

The 3V minimum input voltage allows for operation in low-power applications.

Maximum Input Voltage: 18 V

The 18V maximum input voltage supports a wide range of power supply requirements.

Technical Specifications

Power Management ICs MC33342DG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

.05 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

760 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

MC33342DG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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