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MC33033DWG

Onsemi

MC33033DWG by Onsemi

MC33033DWG by Onsemi is a Motion Control IC with 20V supply voltage, 0.1A output current, and 22mA supply current. It is used as a Brushless DC Motor Controller in industrial applications due to its bipolar technology and small outline package style. Operating temperature ranges from -40°C to 85°C.

Median Price

$2.134

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

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Vyrian

USA . 10,302 parts In-Stock

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Chip Stock

USA . 6,880 parts In-Stock

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Digiode

USA . 360 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 85 parts In-Stock

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Speed Components Ltd

Israel . 7 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 265 parts In-Stock

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$2.091

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265

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Netroflash

USA . 2,000 parts In-Stock

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$2.134

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$2.091

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Ampacity Inc.

Singapore . 364 parts In-Stock

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$3.500

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364

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AZTECH Wire

Italy . 820 parts In-Stock

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$6.002

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QUARKTWIN TECHNOLOGY LTD

USA . 24,566 parts In-Stock

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Kulean Microsystems

USA . 7,742 parts In-Stock

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Microchip USA

USA . 5,296 parts In-Stock

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TANS Electronics

Latvia . 2,624 parts In-Stock

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Problanco Electronics

Mexico . 2,585 parts In-Stock

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Corphita

USA . 2,160 parts In-Stock

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Metaverse IC Inc.

Canada . 900 parts In-Stock

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SupplyDigital Components

Austria . 789 parts In-Stock

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UHIMA Technologies

Türkiye . 288 parts In-Stock

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Perfect Parts

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Assy Fe

Spain . 16 parts In-Stock

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Overview

Looking for top-quality motion control ICs? Look no further than the MC33033DWG by Onsemi. With a reputation for excellence, Onsemi provides reliable and efficient products that cater to a wide range of applications in the industry. The MC33033DWG offers customers unmatched value, benefits, and advantages in controlling brushless DC motors with ease. Say goodbye to technical headaches and hello to seamless motion control with Onsemi's MC33033DWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the motion control IC, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 20 V

Suitable voltage range for efficient operation of the motion control IC, ensuring optimal performance.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial applications where heat may be a concern.

Technology: BIPOLAR

Bipolar technology provides precise control and accuracy in managing motion control for various applications.

Technical Specifications

Motion Control ICs MC33033DWG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

20

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

22 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

MC33033DWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-656-0437, 5962016560437

NIIN

016560437

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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