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MC14556BCPG

Onsemi

MC14556BCPG by Onsemi

MC14556BCPG by Onsemi is a CMOS Decoder & Drivers with 2 functions. It has a propagation delay of 440 ns at 5V, suitable for military-grade applications. The package style is in-line, with through-hole terminals and inverted output polarity.

Median Price

$0.484

Lifecycle Status

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8

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1k+

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Arrow

USA . 13 parts In-Stock

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$0.990

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Rochester

USA . 2,007 parts In-Stock

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$0.423

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$0.351

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$0.313

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DigiKey

USA . 2,007 parts In-Stock

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$0.530

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Verical

USA . 974 parts In-Stock

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$0.391

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Digiode

USA . 1,366 parts In-Stock

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Vyrian

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Prism Electronics

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Corphita

USA . 543 parts In-Stock

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Corohmni

South Africa . 453 parts In-Stock

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$0.347

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AZTECH Wire

Italy . 1,192 parts In-Stock

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TANS Electronics

Latvia . 6,792 parts In-Stock

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Continental Prestige Electronics

USA . 4,090 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Microchip USA

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UHIMA Technologies

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Kulean Microsystems

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Overview

Enhance your electronic designs with the MC14556BCPG by Onsemi, a top-quality decoder and driver that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this versatile component is perfect for a wide range of applications. With its inverted output polarity and standard input conditioning, the MC14556BCPG provides exceptional value to customers seeking precision and efficiency in their projects. Don't settle for less when you can choose the best - experience the benefits of the MC14556BCPG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 440 ns

Fast propagation delay ensures quick response times, making this decoder & driver efficient in time-sensitive operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures up to 125°C, suitable for use in industrial and automotive environments.

Technology: CMOS

Utilizes CMOS technology which offers low power consumption and high noise immunity, making this decoder & driver energy-efficient and reliable.

Technical Specifications

Decoder & Drivers MC14556BCPG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

4000/14000/40000

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14556BCPG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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