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MC14555BFELG

Onsemi

MC14555BFELG by Onsemi

MC14555BFELG by Onsemi is a CMOS Decoder & Drivers with 440 ns Propagation Delay, 16 terminals, and 5V nominal voltage. It is used in military-grade applications requiring true output polarity and standard input conditioning. The small outline package makes it suitable for surface mount installations.

Median Price

$0.819

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,865 parts In-Stock

1+ parts

-

100+ parts

$0.819

1k+ parts

$0.680

10k+ parts

$0.606

3,865

-

$0.819

$0.680

$0.606

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,620 parts In-Stock

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$0.638

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1,620

$0.638

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Vyrian

USA . 5,567 parts In-Stock

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5,567

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Distributors (Availability)

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Corphita

USA . 701 parts In-Stock

1+ parts

$0.605

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701

$0.605

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Corohmni

South Africa . 327 parts In-Stock

1+ parts

$0.639

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327

$0.639

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Component Stockers USA

USA . 5,578 parts In-Stock

1+ parts

$0.700

100+ parts

$0.650

1k+ parts

$0.590

10k+ parts

-

5,578

$0.700

$0.650

$0.590

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AZTECH Wire

Italy . 356 parts In-Stock

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$13.310

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356

$13.310

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Problanco Electronics

Mexico . 8,314 parts In-Stock

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Kulean Microsystems

USA . 7,353 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,514 parts In-Stock

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Continental Prestige Electronics

USA . 3,865 parts In-Stock

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$0.578

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3,865

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Perfect Parts

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Assy Fe

Spain . 1,880 parts In-Stock

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Kepictronics

USA . 1,865 parts In-Stock

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SupplyDigital Components

Austria . 1,480 parts In-Stock

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TANS Electronics

Latvia . 1,190 parts In-Stock

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ChipstoGo Electronic ltd

UK . 466 parts In-Stock

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UHIMA Technologies

Türkiye . 350 parts In-Stock

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350

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Microchip USA

USA . 288 parts In-Stock

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288

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Overview

Unlock the full potential of your electronic devices with the MC14555BFELG by Onsemi. Designed with precision and reliability, Onsemi delivers top-notch quality in every product. The MC14555BFELG falls under the Decoder & Drivers category, offering versatile applications for your projects. With a nominal supply voltage of 5V and a propagation delay of 440 ns, this decoder provides seamless performance. Trust Onsemi to provide you with cutting-edge technology that exceeds expectations, giving you the value, benefits, and advantages you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the decoder & driver, making it suitable for various applications.

Propagation Delay At Nominal Supply: 440 ns

With a fast propagation delay, this decoder & driver ensures quick response times, making it ideal for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for integration into compact electronic devices.

Input Conditioning: STANDARD

The standard input conditioning ensures compatibility with a wide range of input signals, providing flexibility in system design.

No. of Functions: 2

Having multiple functions in one device simplifies circuit design and reduces component count, making it cost-effective and efficient.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V makes this decoder & driver suitable for use in many electronic systems and ensures compatibility with common power sources.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures efficient performance and minimal signal distortion, making it reliable for high-speed applications.

Power Supplies (V): 5/15

The compatibility with dual power supplies at 5V and 15V offers versatility in system configuration and power options, catering to a wider range of applications.

No. of Terminals: 16

The 16 terminals provide ample connection options and allow for easy interfacing with external devices, enhancing the versatility of the decoder & driver.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance in harsh environments and industrial applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this decoder & driver is suitable for use in extreme cold conditions, expanding its applicability to various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and reliability in electrical connections, ensuring long-term performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and connection orientation, allowing for easier integration and installation in different electronic systems.

Width: 5.275 mm

The compact width of 5.275 mm saves space on the PCB, making it suitable for use in compact electronic devices and applications with limited board space.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other components, making it a reliable choice for signal processing applications.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage of 3V allows for operation in low-power applications and contributes to energy efficiency in electronic systems.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C and a maximum time at peak reflow temperature of 30s, this decoder & driver can withstand the soldering process during assembly without compromising performance.

Temperature Grade: MILITARY

The military-grade temperature rating ensures durability and reliability in extreme environmental conditions, making this product suitable for defense and aerospace applications.

Technology: CMOS

The CMOS technology used in this decoder & driver offers low power consumption, high noise immunity, and fast switching speeds, making it a reliable choice for various digital applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliable performance and durability in the long run.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this decoder & driver can withstand standard exposure to moisture during storage and handling, ensuring reliability in various operating conditions.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage of 18V allows for compatibility with a wide range of power sources and enhances the versatility of this decoder & driver in different electronic systems.

Technical Specifications

Decoder & Drivers MC14555BFELG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

4000/14000/40000

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC14555BFELG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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