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MC14511BFELG

Onsemi

MC14511BFELG by Onsemi

MC14511BFELG by Onsemi is a CMOS Decoder & Driver with 16 terminals, Vsup range of 3-18V, and propagation delay of 1440ns. It operates in -55 to 125 °C, suitable for military applications requiring latched input conditioning and true output polarity.

Median Price

$0.452

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 57,946 parts In-Stock

1+ parts

-

100+ parts

$0.436

1k+ parts

$0.362

10k+ parts

$0.323

57,946

-

$0.436

$0.362

$0.323

DigiKey

USA . 57,946 parts In-Stock

1+ parts

-

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$0.550

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57,946

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-

$0.550

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Verical

USA . 39,689 parts In-Stock

1+ parts

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100+ parts

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$0.452

10k+ parts

$0.403

39,689

-

-

$0.452

$0.403

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,147 parts In-Stock

1+ parts

$0.339

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1,147

$0.339

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Vyrian

USA . 12,983 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 957 parts In-Stock

1+ parts

$0.321

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957

$0.321

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Corohmni

South Africa . 78 parts In-Stock

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$0.357

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78

$0.357

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AZTECH Wire

Italy . 1,155 parts In-Stock

1+ parts

$19.920

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1,155

$19.920

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Continental Prestige Electronics

USA . 57,946 parts In-Stock

1+ parts

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$0.308

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57,946

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$0.308

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Microchip USA

USA . 4,365 parts In-Stock

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Problanco Electronics

Mexico . 4,243 parts In-Stock

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TANS Electronics

Latvia . 3,783 parts In-Stock

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SupplyDigital Components

Austria . 2,383 parts In-Stock

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Kulean Microsystems

USA . 774 parts In-Stock

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UHIMA Technologies

Türkiye . 434 parts In-Stock

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Overview

Discover the unparalleled quality and precision of Onsemi's MC14511BFELG Decoder & Drivers. This innovative product offers a wide range of applications, providing exceptional value and benefits to customers. With a compact package style and advanced technology, this decoder ensures optimal performance in various scenarios. Trust Onsemi for reliable solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the decoder & drivers, ensuring a longer product lifespan.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and enhancing reliability.

Input Conditioning: LATCHED

Latched input conditioning helps in stable operation by maintaining the input values until a new input is received, enhancing the overall performance of the device.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage level of 5V, making it compatible with a wide range of electronic systems.

Propagation Delay (tpd): 1440 ns

Low propagation delay ensures fast processing of input signals, making the decoder & drivers suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliability in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder & drivers energy-efficient and reliable.

Technical Specifications

Decoder & Drivers MC14511BFELG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

CMOS

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1440 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC14511BFELG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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