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MC14066BFEL

Onsemi

MC14066BFEL by Onsemi

MC14066BFEL by Onsemi is a CMOS SPST multiplexer with 4 functions, 14 terminals, and 5V nominal voltage. It operates in a temperature range of -55 to 125 °C and is suitable for military-grade applications requiring separate output switches.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,210 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

2,210

-

$0.132

$0.110

$0.098

Distributors (In-Stock)

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Digiode

USA . 839 parts In-Stock

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$0.103

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839

$0.103

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Vyrian

USA . 9,061 parts In-Stock

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9,061

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,337 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,703 parts In-Stock

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$0.097

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$0.097

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Corohmni

South Africa . 87 parts In-Stock

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$0.108

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87

$0.108

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AZTECH Wire

Italy . 51 parts In-Stock

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$11.680

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51

$11.680

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SupplyDigital Components

Austria . 5,782 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,066 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,522 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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Problanco Electronics

Mexico . 4,035 parts In-Stock

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Assy Fe

Spain . 2,700 parts In-Stock

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Kulean Microsystems

USA . 2,315 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,000 parts In-Stock

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Glotronic Ltd.

UK . 1,600 parts In-Stock

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UHIMA Technologies

Türkiye . 399 parts In-Stock

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399

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Microchip USA

USA . 176 parts In-Stock

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Overview

Enhance your electronic designs with the MC14066BFEL multiplexer and switch from Onsemi. This versatile component offers reliable performance and durability thanks to Onsemi's reputation for high-quality manufacturing. Ideal for a wide range of applications, this product provides seamless switching between various functions, ensuring smooth operation and efficiency. Upgrade your projects with the value and benefits that the MC14066BFEL brings, delivering superior performance and precision for all your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to environmental factors, ensuring the product's longevity and reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort.

No. of Functions: 4

Provides multiple functions in a single device, offering versatility and efficiency in circuit design.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard voltage level, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a variety of operating environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and fast operation, making it energy-efficient and reliable.

Technical Specifications

Multiplexers & Switches MC14066BFEL attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

80 ns

Maximum Switch-on Time:

120 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.275 mm

Trade Compliance

MC14066BFEL Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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