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MC10H351P

Onsemi

MC10H351P by Onsemi

MC10H351P by Onsemi is a voltage level translator with 4 functions, operating b/w 0-75°C. It has a supply voltage range of 4.75-5.25 V and offers fast operation with a max delay of 2.2 ns. Ideal for TTL/NMOS to ECL translation in commercial extended temperature applications.

Median Price

$7.875

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

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Farnell

UK . 7,291 parts In-Stock

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$7.919

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Rochester

USA . 7,249 parts In-Stock

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$6.300

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$5.640

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$5.300

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$5.300

Verical

USA . 3,430 parts In-Stock

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$7.875

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$7.050

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$6.625

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$6.625

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Forefront Electronics and Design

USA . 468 parts In-Stock

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Digiode

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Vyrian

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Freelance Electronics

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$10.340

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Component Electronics Inc.

Canada . 3 parts In-Stock

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$15.380

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$11.540

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$10.000

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Mil-Aero Solutions, Inc.

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Fibra_Brandt Electronic GMBH

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Sea View Technologies

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PC Components Company LLC

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Cyclops Electronics Ltd

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Inland Empire Components Inc.

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Resion

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Corohmni

South Africa . 422 parts In-Stock

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Corphita

USA . 636 parts In-Stock

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Continental Prestige Electronics

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Problanco Electronics

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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SupplyDigital Components

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Kulean Microsystems

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Metaverse IC Inc.

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UHIMA Technologies

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Overview

Elevate your voltage level translation needs with the MC10H351P by Onsemi. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Ideal for a variety of applications, this voltage level translator boasts superior performance and efficiency. Experience seamless operation and enhanced functionality with Onsemi's cutting-edge technology. Upgrade your projects with the MC10H351P today and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Maximum Supply Voltage: 5.25 V

Allows for a wide range of input voltages, providing flexibility in various applications.

No. of Functions: 4

Can handle multiple functions simultaneously, making it versatile and efficient.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing circuit designs.

Maximum Operating Temperature: 75 °C

Can withstand high temperatures, ensuring reliable performance in challenging environments.

Technical Specifications

Voltage Level Translators MC10H351P attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Interface IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

Length:

26.415 mm

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC10H351P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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