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M74HCT4066ADTR2G

Onsemi

M74HCT4066ADTR2G by Onsemi

M74HCT4066ADTR2G by Onsemi is a CMOS SPST switch with 4 functions, 120 ohm Ron, and 37 ns switch-on time. Ideal for military-grade applications requiring a small outline package with thin profile and shrink pitch design. Offers nominal off-state isolation of 40 dB and operates b/w -55 to 125 °C temperature range.

Median Price

$0.342

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,477 parts In-Stock

1+ parts

$0.700

100+ parts

$0.486

1k+ parts

$0.332

10k+ parts

$0.252

2,477

$0.700

$0.486

$0.332

$0.252

Flip Electronics (Authorized)

USA . 25,000 parts In-Stock

1+ parts

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Rochester

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$0.305

1k+ parts

$0.253

10k+ parts

$0.226

2,400

-

$0.305

$0.253

$0.226

DigiKey

USA . 2,400 parts In-Stock

1+ parts

-

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$0.380

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2,400

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-

$0.380

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Verical

USA . 2,400 parts In-Stock

1+ parts

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$0.282

2,400

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-

$0.282

Distributors (In-Stock)

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Digiode

USA . 460 parts In-Stock

1+ parts

$0.238

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460

$0.238

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Vyrian

USA . 1,904 parts In-Stock

1+ parts

$0.250

100+ parts

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1,904

$0.250

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Flip Electronics

USA . 25,000 parts In-Stock

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25,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 461 parts In-Stock

1+ parts

$0.225

100+ parts

-

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461

$0.225

-

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Corohmni

South Africa . 105 parts In-Stock

1+ parts

$0.250

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105

$0.250

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Kepictronics

USA . 61,000 parts In-Stock

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61,000

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QUARKTWIN TECHNOLOGY LTD

USA . 27,767 parts In-Stock

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Kulean Microsystems

USA . 7,465 parts In-Stock

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SupplyDigital Components

Austria . 5,088 parts In-Stock

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TANS Electronics

Latvia . 3,987 parts In-Stock

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3,987

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Problanco Electronics

Mexico . 3,628 parts In-Stock

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3,628

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UHIMA Technologies

Türkiye . 755 parts In-Stock

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755

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Overview

Discover the reliable M74HCT4066ADTR2G by Onsemi, a top-quality multiplexer and switch perfect for various applications. Onsemi is known for its high standards in manufacturing, ensuring durability and efficiency in every product. With this versatile device, customers can experience seamless switching capabilities and enhanced performance. Say goodbye to technical glitches and hello to smooth operations with the M74HCT4066ADTR2G. Upgrade your systems today and enjoy the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and resistance to external factors, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Provides versatility by offering multiple functions in a single device, reducing the need for additional components.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard voltage requirements in electronic applications, making it widely usable.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Maximum Input Voltage: 5.5 V

Withstands high input voltages, providing a safety margin and preventing damage to the device.

Technical Specifications

Multiplexers & Switches M74HCT4066ADTR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

20 ohm

Maximum On-state Resistance (Ron):

120 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.025 A

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

45 ns

Maximum Switch-on Time:

37 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

M74HCT4066ADTR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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