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M74HCT4052ADTR2G

Onsemi

M74HCT4052ADTR2G by Onsemi

M74HCT4052ADTR2G by Onsemi is a CMOS dual multiplexer with 4 channels, 190 ohm max on-state resistance, and 345 ns max switch-on time. Ideal for military-grade applications requiring small outline packages and high isolation levels. Operating temperature range from -55 to 125 °C with supply voltage ranging from 2V to 12V.

Median Price

$0.413

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,499 parts In-Stock

1+ parts

$0.256

100+ parts

$0.241

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$0.218

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1,499

$0.256

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Mouser Electronics

USA . 6,390 parts In-Stock

1+ parts

$0.570

100+ parts

$0.312

1k+ parts

$0.266

10k+ parts

$0.243

6,390

$0.570

$0.312

$0.266

$0.243

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Digiode

USA . 541 parts In-Stock

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$0.243

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541

$0.243

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Vyrian

USA . 622 parts In-Stock

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$0.256

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622

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Flip Electronics

USA . 5,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,387 parts In-Stock

1+ parts

$0.230

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2,387

$0.230

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Corohmni

South Africa . 448 parts In-Stock

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$0.256

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448

$0.256

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Kepictronics

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 6,826 parts In-Stock

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SupplyDigital Components

Austria . 4,737 parts In-Stock

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Problanco Electronics

Mexico . 789 parts In-Stock

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UHIMA Technologies

Türkiye . 288 parts In-Stock

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TANS Electronics

Latvia . 35 parts In-Stock

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Overview

Enhance your electronic designs with the M74HCT4052ADTR2G by Onsemi, a top-tier manufacturer known for delivering high-quality products. As part of the Multiplexers & Switches category, this surface-mount device offers seamless switching between 2 functions, making it ideal for a wide range of applications. With its compact size, advanced technology, and military-grade temperature grade, this versatile IC provides unmatched value and benefits to customers looking for reliable performance and superior functionality in their projects. Elevate your designs with the M74HCT4052ADTR2G and experience the difference that quality and innovation can make.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions allows for versatile use in different circuit configurations, increasing flexibility for the user.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this multiplexer can withstand harsh environmental conditions and prolonged use.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits, making it an efficient choice for signal switching applications.

Technical Specifications

Multiplexers & Switches M74HCT4052ADTR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

2

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

30 ohm

Maximum On-state Resistance (Ron):

190 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

220 ns

Maximum Switch-on Time:

345 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

M74HCT4052ADTR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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