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LV8805V-TLM-H

Onsemi

LV8805V-TLM-H by Onsemi

LV8805V-TLM-H by Onsemi is a Motion Control IC with 12V supply voltage, 1.2A output current, and BICMOS technology. Ideal for AC motor control applications in industrial settings due to its compact size, low profile package, and wide operating temperature range from -40 °C to 95°C.

Median Price

$1.642

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,000 parts In-Stock

1+ parts

-

100+ parts

$1.610

1k+ parts

$1.340

10k+ parts

$1.190

22,000

-

$1.610

$1.340

$1.190

Verical

USA . 22,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.675

10k+ parts

$1.488

22,000

-

-

$1.675

$1.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,956 parts In-Stock

1+ parts

$1.254

100+ parts

-

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-

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1,956

$1.254

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-

-

Vyrian

USA . 3,175 parts In-Stock

1+ parts

-

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3,175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 21,692 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

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21,692

$0.990

-

-

-

Corohmni

South Africa . 214 parts In-Stock

1+ parts

$1.170

100+ parts

-

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214

$1.170

-

-

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Corphita

USA . 2,369 parts In-Stock

1+ parts

$1.188

100+ parts

-

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2,369

$1.188

-

-

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AZTECH Wire

Italy . 1,051 parts In-Stock

1+ parts

$10.770

100+ parts

-

1k+ parts

-

10k+ parts

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1,051

$10.770

-

-

-

Continental Prestige Electronics

USA . 22,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.130

10k+ parts

-

22,000

-

-

$1.130

-

TANS Electronics

Latvia . 7,374 parts In-Stock

1+ parts

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7,374

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Kulean Microsystems

USA . 3,138 parts In-Stock

1+ parts

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3,138

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SupplyDigital Components

Austria . 3,035 parts In-Stock

1+ parts

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3,035

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

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1,800

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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1,200

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Kepictronics

USA . 1,019 parts In-Stock

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1,019

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Microchip USA

USA . 257 parts In-Stock

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257

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UHIMA Technologies

Türkiye . 215 parts In-Stock

1+ parts

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215

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Problanco Electronics

Mexico . 72 parts In-Stock

1+ parts

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72

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Overview

Discover the innovative LV8805V-TLM-H by Onsemi, a cutting-edge Motion Control IC that brings unparalleled performance and reliability to your applications. Manufactured by industry leader Onsemi, this product offers superior quality and precision engineering. With a wide range of applications in AC motor control, this IC provides seamless operation and efficiency. Enjoy the benefits of advanced technology, high output current, and low profile design. Elevate your projects with the value and advantages that only the LV8805V-TLM-H can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package material provides good insulation and protection for the IC, making it more durable and reliable in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and enabling automated assembly processes.

Nominal Supply Voltage (Vsup): 12 V

Operating at a standard supply voltage of 12V makes it compatible with common power sources, simplifying system design and integration.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance, low power consumption, and high voltage tolerance.

Maximum Output Current: 1.2 A

Capable of handling a maximum output current of 1.2A, making it suitable for driving motors and other high-current applications efficiently.

Technical Specifications

Motion Control ICs LV8805V-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.3,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

3.6 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width (mm):

5.6 mm

Trade Compliance

LV8805V-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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