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LV8075LP-E

Onsemi

LV8075LP-E by Onsemi

LV8075LP-E by Onsemi is a Motion Control IC in PLASTIC/EPOXY package. Operates at -30 to 85 °C with 3V supply, BICMOS tech, and 16 terminals in SQUARE shape. Ideal for motion control applications requiring low power consumption and compact design.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,124 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.050

10k+ parts

$0.940

2,124

-

$1.270

$1.050

$0.940

DigiKey

USA . 2,124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.590

10k+ parts

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2,124

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-

$1.590

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Verical

USA . 2,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.313

10k+ parts

$1.175

2,024

-

-

$1.313

$1.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 663 parts In-Stock

1+ parts

$0.988

100+ parts

-

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663

$0.988

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Chip Stock

USA . 70,000 parts In-Stock

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70,000

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Vyrian

USA . 8,693 parts In-Stock

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8,693

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,083 parts In-Stock

1+ parts

$0.780

100+ parts

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2,083

$0.780

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Corohmni

South Africa . 152 parts In-Stock

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$0.917

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152

$0.917

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Corphita

USA . 2,039 parts In-Stock

1+ parts

$0.936

100+ parts

-

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2,039

$0.936

-

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AZTECH Wire

Italy . 748 parts In-Stock

1+ parts

$21.550

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748

$21.550

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QUARKTWIN TECHNOLOGY LTD

USA . 6,261 parts In-Stock

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TANS Electronics

Latvia . 5,176 parts In-Stock

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Microchip USA

USA . 5,049 parts In-Stock

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5,049

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SupplyDigital Components

Austria . 2,999 parts In-Stock

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2,999

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Continental Prestige Electronics

USA . 2,124 parts In-Stock

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100+ parts

$0.888

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2,124

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$0.888

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Kulean Microsystems

USA . 1,026 parts In-Stock

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1,026

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 899 parts In-Stock

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899

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Perfect Parts

USA . 268 parts In-Stock

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268

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Problanco Electronics

Mexico . 83 parts In-Stock

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83

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Overview

Unleash the power of precision with the LV8075LP-E by Onsemi, a cutting-edge motion control IC that promises unrivaled quality and performance. Crafted by the renowned manufacturer Onsemi, this chip carrier package is designed for seamless integration in various applications, offering a nominal supply voltage of 3V and maximum supply current of 1mA. With its innovative technology and robust design, the LV8075LP-E guarantees optimal functionality in extreme temperatures from -30 to 85 °C. Elevate your projects with the reliability and efficiency of the LV8075LP-E, a game-changer in motion control ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Nominal Supply Voltage (Vsup): 3 V

The 3V supply voltage is common in many systems, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can perform reliably in a variety of environments.

Technology: BICMOS

The use of BICMOS technology ensures high performance and efficiency in motion control applications.

Technical Specifications

Motion Control ICs LV8075LP-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1 mA

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV8075LP-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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