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LV5744V-TLM-E

Onsemi

LV5744V-TLM-E by Onsemi

LV5744V-TLM-E by Onsemi is a voltage-mode switching regulator with max. operating temp of 85 °C and BICMOS technology. It has 16 terminals, operates at up to 480 kHz, and is ideal for industrial applications requiring high-frequency control.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 9,897 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 586 parts In-Stock

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Kepictronics

USA . 42,000 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 7,291 parts In-Stock

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SupplyDigital Components

Austria . 6,119 parts In-Stock

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Problanco Electronics

Mexico . 4,568 parts In-Stock

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TANS Electronics

Latvia . 3,382 parts In-Stock

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Corphita

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Corohmni

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Microchip USA

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UHIMA Technologies

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Overview

Enhance your power management systems with the LV5744V-TLM-E by Onsemi, a top-tier manufacturer known for quality and reliability. This switching regulator and controller offers unparalleled performance in a compact package, making it ideal for a wide range of applications. From industrial to automotive, the LV5744V-TLM-E delivers superior control and efficiency, ensuring optimized power distribution in any project. Upgrade your design with this advanced technology and experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material offers good durability and protection for the internal components of the switching regulator, making it suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, allowing for easier integration into electronic devices with limited space.

No. of Terminals: 16

Having a higher number of terminals enables more connectivity options and functionality within the switching regulator.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this switching regulator can withstand elevated temperatures without compromising performance or reliability.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of the output voltage, ensuring stable and efficient operation of the switching regulator.

Maximum Switching Frequency: 480 kHz

High switching frequency allows for faster response times and more efficient power conversion, making the switching regulator ideal for applications requiring high performance.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed performance and low power consumption for the switching regulator.

Technical Specifications

Switching Regulators & Controllers LV5744V-TLM-E attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

480 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV5744V-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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