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LV5761V-TLM-E

Onsemi

LV5761V-TLM-E by Onsemi

LV5761V-TLM-E by Onsemi is a small outline, shrink pitch switching regulator with 16 terminals. It operates in industrial temperature range (-40 to 85 °C) and has a max output current of 5mA at 140 kHz switching frequency. Ideal for applications requiring current-mode control in compact designs.

Median Price

$1.815

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.400

10k+ parts

$1.320

4,000

-

$1.570

$1.400

$1.320

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.060

10k+ parts

-

4,000

-

-

$2.060

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 131 parts In-Stock

1+ parts

$1.653

100+ parts

-

1k+ parts

-

10k+ parts

-

131

$1.653

-

-

-

Vyrian

USA . 4,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,005

-

-

-

-

DigiKey Marketplace

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$1.810

1k+ parts

-

10k+ parts

-

4,000

-

$1.810

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,077 parts In-Stock

1+ parts

$1.566

100+ parts

-

1k+ parts

-

10k+ parts

-

2,077

$1.566

-

-

-

Corohmni

South Africa . 175 parts In-Stock

1+ parts

$1.740

100+ parts

-

1k+ parts

-

10k+ parts

-

175

$1.740

-

-

-

AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$17.630

100+ parts

-

1k+ parts

-

10k+ parts

-

545

$17.630

-

-

-

Kulean Microsystems

USA . 8,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,324

-

-

-

-

Problanco Electronics

Mexico . 7,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,632

-

-

-

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TANS Electronics

Latvia . 4,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,777

-

-

-

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SupplyDigital Components

Austria . 4,573 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,573

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-

-

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UHIMA Technologies

Türkiye . 933 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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933

-

-

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Microchip USA

USA . 118 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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118

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Overview

Experience unparalleled quality and reliability with the LV5761V-TLM-E by Onsemi, a leading manufacturer in the industry. This switching regulator/controller offers exceptional performance in a wide range of applications, providing customers with superior value and benefits. With its innovative technology and industrial-grade design, this product ensures efficiency and precision, making it the perfect choice for your electronic projects. Trust Onsemi to deliver excellence with the LV5761V-TLM-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the circuit board, optimizing space utilization.

No. of Terminals: 16

Having a higher number of terminals provides more connectivity options and flexibility in circuit design.

Package Style: SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design make the product compact and suitable for applications where space is limited.

Maximum Operating Temperature: 85 C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance.

Control Mode: CURRENT-MODE

Current-mode control offers better dynamic response and stability, improving the overall efficiency of the switching regulator.

Minimum Operating Temperature: -40 C

The low minimum operating temperature allows the product to function in a wide range of environmental conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand harsh operating conditions and maintain performance reliability.

Maximum Switching Frequency: 140 kHz

Higher switching frequency allows for faster response times and more precise regulation of the output voltage.

Maximum Output Current: 0.005 A

Although low, the maximum output current is suitable for low-power applications, making the product energy-efficient.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy handling during assembly, contributing to overall product reliability.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density mounting, enabling more components to be placed on the circuit board.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product is less sensitive to moisture absorption, ensuring consistent performance even in humid environments.

Technical Specifications

Switching Regulators & Controllers LV5761V-TLM-E attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

140 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV5761V-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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