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LV5011MD

Onsemi

LV5011MD by Onsemi

LV5011MD by Onsemi is a DOT MATRIX LED DISPLAY DRIVER with 10 terminals. It operates b/w -30 to 125 °C and supports supply voltage from 8.5V to 24V. Ideal for graphics display applications, this BICMOS technology chip comes in a small outline package with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,536 parts In-Stock

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1,536

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Vyrian

USA . 766 parts In-Stock

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766

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,259 parts In-Stock

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7,259

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Problanco Electronics

Mexico . 4,941 parts In-Stock

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4,941

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TANS Electronics

Latvia . 4,343 parts In-Stock

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4,343

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Kulean Microsystems

USA . 2,644 parts In-Stock

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Corphita

USA . 1,250 parts In-Stock

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1,250

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UHIMA Technologies

Türkiye . 566 parts In-Stock

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566

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Corohmni

South Africa . 83 parts In-Stock

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Perfect Parts

USA . 4 parts In-Stock

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Overview

Enhance your display experience with the LV5011MD by Onsemi, a top-notch graphics display driver that guarantees superior quality and performance. Onsemi's reputation for excellence in manufacturing ensures reliability and durability in every product. Ideal for a wide range of applications, this LED display driver offers unmatched value and benefits to customers, providing seamless integration, maximum supply voltage of 24V, and a compact design for easy installation. Upgrade your display capabilities with the LV5011MD and discover the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, making it suitable for a variety of applications.

Display Mode: DOT MATRIX

Dot matrix display mode allows for a high level of customization and flexibility in displaying information.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the PCB.

Maximum Supply Voltage: 24 V

High maximum supply voltage allows for compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts.

No. of Terminals: 10

Sufficient number of terminals for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the PCB and allows for dense integration.

Minimum Supply Voltage: 8.5 V

Low minimum supply voltage allows for operation in a wide variety of systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments.

Minimum Operating Temperature: -30 °C

Wide range of minimum operating temperature allows for operation in extreme conditions.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection options.

Maximum Seated Height: 1.75 mm

Low seated height enables compact designs and slim form factors.

Width: 3.9 mm

Compact width size saves PCB real estate for other components.

Length: 4.9 mm

Short length makes the package space-efficient and suitable for compact designs.

Technology: BICMOS

BICMOS technology offers a good balance of speed and power efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides good mechanical strength and reliability in connection.

Nominal Supply Voltage: 12 V

Stable nominal supply voltage for consistent operation of the display driver.

Terminal Pitch: 1 mm

Fine terminal pitch allows for precise connections and compact layout designs.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface IC type provides compatibility with LED display panels.

Technical Specifications

Graphics Display Drivers LV5011MD attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Display Mode:

DOT MATRIX

Interface IC Type:

JESD-30 Code:

R-PDSO-G10

Length:

4.9 mm

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

24 V

Minimum Supply Voltage:

8.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LV5011MD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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