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LV5026MC

Onsemi

LV5026MC by Onsemi

LV5026MC by Onsemi is a LED display driver with 10 terminals, BICMOS technology, and 9 segments. It operates b/w -30 to 125 °C with supply voltage range of 8.5V to 24V. Ideal for graphics displays due to its small outline package and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 683 parts In-Stock

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683

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Digiode

USA . 410 parts In-Stock

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410

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 5,980 parts In-Stock

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5,980

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TANS Electronics

Latvia . 4,575 parts In-Stock

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4,575

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Problanco Electronics

Mexico . 3,396 parts In-Stock

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3,396

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Corphita

USA . 1,885 parts In-Stock

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1,885

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Kulean Microsystems

USA . 562 parts In-Stock

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562

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Corohmni

South Africa . 320 parts In-Stock

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320

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UHIMA Technologies

Türkiye . 185 parts In-Stock

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Overview

Elevate your display experience with the LV5026MC by Onsemi. Crafted with precision and cutting-edge BICMOS technology, this LED display driver delivers unparalleled performance and reliability. From enhancing graphics in automotive displays to optimizing signage in retail environments, this small outline package offers endless possibilities. With a maximum supply voltage of 24V and a nominal supply voltage of 12V, this versatile device ensures seamless integration and optimal functionality. Experience the difference with Onsemi's innovative solutions and elevate your visual displays to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and resistant to damage.

Surface Mount: YES

This feature allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 24 V

With a high maximum supply voltage, this product can handle a wide range of power requirements.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into existing designs and layouts.

No. of Terminals: 10

Having multiple terminals allows for more connections and flexibility in use.

Minimum Supply Voltage: 8.5 V

With a low minimum supply voltage, this product can operate efficiently even with lower power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability even in harsh environments or extended use.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows this product to function in a wide range of conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures stability in connections.

Maximum Seated Height: 1.75 mm

With a low seated height, this product can fit into compact spaces without sacrificing performance.

Width: 3.9 mm

The narrow width makes this product suitable for applications where space is limited.

Length: 4.9 mm

The short length allows for efficient use of PCB real estate and easier integration into existing designs.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of CMOS and bipolar technologies, resulting in improved performance and efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides stability and ease of soldering during installation.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V is a common and convenient power requirement for many systems.

No. of Segments: 9

Having multiple segments allows for more complex display configurations and applications.

Terminal Pitch: 1 mm

The 1mm terminal pitch provides a good balance between compact design and ease of soldering.

Interface IC Type: LED DISPLAY DRIVER

This interface type specifically caters to LED display drivers, ensuring optimal performance and compatibility.

Technical Specifications

Graphics Display Drivers LV5026MC attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G10

Length:

4.9 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

9

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

24 V

Minimum Supply Voltage:

8.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LV5026MC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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