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LV5026M

Onsemi

LV5026M by Onsemi

LV5026M by Onsemi is a BICMOS LED display driver with 10 terminals, operating from -30 to 125 °C. It supports supply voltage range of 8.5-24 V and comes in a small outline package for graphics applications. The terminal pitch is 1 mm, making it suitable for surface mount designs with low profile requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,463 parts In-Stock

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1,463

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Digiode

USA . 705 parts In-Stock

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705

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,184 parts In-Stock

1+ parts

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7,184

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TANS Electronics

Latvia . 4,240 parts In-Stock

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4,240

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SupplyDigital Components

Austria . 3,219 parts In-Stock

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3,219

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Problanco Electronics

Mexico . 1,326 parts In-Stock

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1,326

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Corphita

USA . 1,204 parts In-Stock

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UHIMA Technologies

Türkiye . 363 parts In-Stock

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363

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Corohmni

South Africa . 341 parts In-Stock

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341

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Overview

Discover the power of seamless graphics display with the LV5026M by Onsemi. Crafted with precision and expertise, this LED display driver offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures efficient performance and optimal functionality. Elevate your projects with the cutting-edge technology of Onsemi's LV5026M, providing exceptional value and benefits for all your display driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 24 V

Capable of handling a higher supply voltage for flexibility in power requirements.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into circuit designs and layouts.

No. of Terminals: 10

Having 10 terminals allows for more connection options and flexibility in circuit design.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without risking damage, suitable for various environments.

Minimum Operating Temperature: -30 °C

Capable of operating in low temperatures, making it versatile for different applications.

Technology: BICMOS

Utilizing BiCMOS technology offers a balance of performance and power efficiency.

Nominal Supply Voltage: 12 V

Provide a stable voltage supply for consistent and reliable performance.

Interface IC Type: LED DISPLAY DRIVER

Specifically designed for driving LED displays, ensuring compatibility and optimized performance.

Technical Specifications

Graphics Display Drivers LV5026M attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G10

Length:

5 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

24 V

Minimum Supply Voltage:

8.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LV5026M Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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