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LC74789

Onsemi

LC74789 by Onsemi

The Onsemi LC74789 is a display controller with 24 terminals, operating at temperatures from -30 to 70 °C. It has a supply voltage of 5V and uses CMOS technology. Ideal for graphics processing applications due to its rectangular package shape and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,762 parts In-Stock

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Digiode

USA . 1,264 parts In-Stock

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SupplyDigital Components

Austria . 7,087 parts In-Stock

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Problanco Electronics

Mexico . 5,634 parts In-Stock

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Kulean Microsystems

USA . 5,112 parts In-Stock

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TANS Electronics

Latvia . 4,401 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Corphita

USA . 1,547 parts In-Stock

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UHIMA Technologies

Türkiye . 976 parts In-Stock

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Corohmni

South Africa . 72 parts In-Stock

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Overview

Elevate your display experience with the LC74789 by Onsemi. Known for their top-notch quality and innovation, Onsemi has crafted this cutting-edge display controller to bring unparalleled clarity and precision to your projects. Whether you're designing high-definition screens, digital signage, or interactive displays, this device offers seamless integration and exceptional performance. With a nominal supply voltage of 5V and a wide operating temperature range, this product ensures reliability and durability in any environment. Trust Onsemi to deliver excellence in every pixel, and elevate your creations to new heights with the LC74789.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices and systems.

Power Supplies (V): 5

The 5V power supply requirement makes it compatible with standard power sources, ensuring easy connectivity.

No. of Terminals: 24

The 24 terminals provide sufficient connectivity options for various input and output devices.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line shrink pitch package style allows for space-efficient and organized circuit board layout.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -30 °C

The minimum operating temperature of -30 °C allows for operation in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting external devices or peripherals.

Peripheral IC Type: GRAPHICS PROCESSOR

The graphics processor peripheral IC type enables high-quality image rendering and display capabilities.

Technology: CMOS

The CMOS technology ensures low power consumption and efficient performance of the display controller.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation process and ensures secure connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is standard and widely compatible with various electronic systems.

Terminal Pitch: 1.78 mm

The terminal pitch of 1.78mm allows for precise and efficient connection with other components on the circuit board.

Technical Specifications

Display Controllers LC74789 attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74789 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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