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LA76922M

Onsemi

LA76922M by Onsemi

LA76922M by Onsemi is a consumer circuit IC with 80 terminals in a rectangular flatpack package. It features gull wing terminals, 0.8 mm pitch, and measures 14mm in width and 20mm in length. This IC is commonly used in various electronic devices for consumer applications due to its compact size and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 447 parts In-Stock

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447

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Vyrian

USA . 66 parts In-Stock

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66

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Distributors (Availability)

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Problanco Electronics

Mexico . 8,310 parts In-Stock

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8,310

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SupplyDigital Components

Austria . 7,961 parts In-Stock

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TANS Electronics

Latvia . 6,552 parts In-Stock

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6,552

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Kulean Microsystems

USA . 2,487 parts In-Stock

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2,487

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Corphita

USA . 1,714 parts In-Stock

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1,714

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Corohmni

South Africa . 425 parts In-Stock

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425

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UHIMA Technologies

Türkiye . 337 parts In-Stock

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337

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Overview

Experience the superior quality and reliability of the LA76922M by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers cutting-edge consumer ICs that provide unmatched performance and efficiency. The LA76922M offers a wide range of applications, making it a versatile choice for various electronic devices. Enhance your product with this top-of-the-line IC, known for its value, benefits, and advantages that will exceed your expectations. Trust Onsemi to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that is commonly used in electronic components, ensuring reliability and longevity.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Compact shape that fits well in modern electronic devices, maximizing functionality and design flexibility.

No. of Terminals: 80

Provides a high level of connectivity and compatibility with various systems, enhancing versatility and application options.

Terminal Position: QUAD

Quad terminal layout allows for efficient routing of connections and reduces signal interference, improving overall performance.

Maximum Seated Height: 3 mm

Low profile design that saves space in compact devices and ensures proper clearance for nearby components.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and excellent soldering reliability, maintaining stable electrical connections over time.

Technical Specifications

Other Function Consumer ICs LA76922M attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G80

Length:

20 mm

No. of Functions:

1

No. of Terminals:

80

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

3 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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