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LA76070

Onsemi

LA76070 by Onsemi

LA76070 by Onsemi is a consumer circuit IC with 52 terminals in an in-line, shrink pitch package. Operating temperature ranges from -10 °C to 65°C. It has a power supply of 7.6V and is commonly used in various consumer electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 769 parts In-Stock

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769

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Vyrian

USA . 339 parts In-Stock

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TANS Electronics

Latvia . 6,163 parts In-Stock

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Kulean Microsystems

USA . 2,866 parts In-Stock

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Problanco Electronics

Mexico . 2,424 parts In-Stock

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Kepictronics

USA . 1,500 parts In-Stock

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SupplyDigital Components

Austria . 1,249 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 816 parts In-Stock

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Corohmni

South Africa . 450 parts In-Stock

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UHIMA Technologies

Türkiye . 213 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the LA76070, a cutting-edge consumer circuit IC designed for a wide range of applications. With its innovative technology and durable construction, this rectangular package IC offers superior performance and efficiency. From home electronics to automotive systems, the LA76070 provides outstanding value and benefits to customers looking for top-notch solutions. Trust Onsemi to deliver excellence in every product, including the versatile LA76070.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the IC, ensuring a longer lifespan.

Package Shape: RECTANGULAR

Allows for easy integration into various circuit designs and layouts.

Power Supplies (V): 7.6

Suitable power supply voltage for many consumer electronic applications, ensuring compatibility.

No. of Terminals: 52

Offers ample connectivity options for various inputs and outputs, allowing for versatile usage.

Maximum Operating Temperature: 65 °C

Ensures reliable performance even under relatively high temperatures, making it suitable for a wide range of environments.

Minimum Operating Temperature: -10 °C

Can operate effectively in cold conditions as well, adding to its versatility.

Terminal Position: DUAL

Dual terminal position allows for increased stability and better connectivity.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low noise operation, making it suitable for demanding consumer applications.

Technical Specifications

Other Function Consumer ICs LA76070 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T52

No. of Terminals:

52

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP52,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

7.6

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LA76070 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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