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LA76075

Onsemi

LA76075 by Onsemi

LA76075 by Onsemi is a consumer IC with 52 terminals, operating at -10 to 65 °C. It has a power supply of 7.6V and uses bipolar technology. This rectangular IC is ideal for consumer circuit applications due to its commercial temperature grade and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,488 parts In-Stock

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Digiode

USA . 122 parts In-Stock

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Electronic Expediters

USA . 9 parts In-Stock

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Assy Fe

Spain . 40,000 parts In-Stock

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TANS Electronics

Latvia . 5,682 parts In-Stock

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Kulean Microsystems

USA . 5,407 parts In-Stock

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Problanco Electronics

Mexico . 4,940 parts In-Stock

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SupplyDigital Components

Austria . 1,603 parts In-Stock

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UHIMA Technologies

Türkiye . 637 parts In-Stock

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Kepictronics

USA . 400 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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Corphita

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Overview

Upgrade your consumer electronics with the LA76075 from Onsemi. Known for their high-quality products, Onsemi brings you a versatile and reliable IC that is perfect for a wide range of applications. With its advanced technology and efficient design, this IC offers unmatched performance and durability. Whether you're looking to enhance your audio system or improve your display devices, the LA76075 delivers exceptional value and benefits. Trust Onsemi to provide you with top-of-the-line solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making the product suitable for consumer applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easier integration and assembly in electronic devices, optimizing space utilization.

Power Supplies (V): 7.6

With a power supply of 7.6V, this product can handle higher voltage requirements, suitable for a wide range of consumer circuits.

No. of Terminals: 52

Having 52 terminals provides flexibility in connectivity options, allowing for more complex circuit designs.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65 °C, this product can withstand higher temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -10 °C

The minimum operating temperature of -10 °C allows for operation in colder environments without compromising functionality.

Terminal Position: DUAL

Dual terminal position enables more efficient signal routing and better organization of connections within the circuit.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the product meets industry standards for consumer electronic applications.

Technology: BIPOLAR

Bipolar technology offers high performance and reliability, making this product a good choice for consumer ICs requiring stable operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and ease of soldering, enhancing the overall durability and longevity of the product.

Terminal Pitch: 1.78 mm

With a terminal pitch of 1.78mm, this product allows for precise and compact placement of components, contributing to efficient circuit design.

Technical Specifications

Other Function Consumer ICs LA76075 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T52

No. of Terminals:

52

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP52,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

7.6

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LA76075 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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