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LA7668N

Onsemi

LA7668N by Onsemi

LA7668N by Onsemi is a consumer circuit IC with 24 terminals, operating at temperatures from -10 °C to 65°C. It has a power supply of 5V and uses bipolar technology. This rectangular package is made of plastic/epoxy and is commonly used in various consumer electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,358 parts In-Stock

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2,358

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Vyrian

USA . 1,641 parts In-Stock

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1,641

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Distributors (Availability)

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SupplyDigital Components

Austria . 8,240 parts In-Stock

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8,240

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Kulean Microsystems

USA . 4,143 parts In-Stock

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4,143

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Problanco Electronics

Mexico . 2,317 parts In-Stock

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Corphita

USA . 1,794 parts In-Stock

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Corohmni

South Africa . 272 parts In-Stock

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UHIMA Technologies

Türkiye . 69 parts In-Stock

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69

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TANS Electronics

Latvia . 34 parts In-Stock

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Overview

Elevate your consumer electronic designs with the LA7668N by Onsemi. Known for their cutting-edge technology and superior quality, Onsemi delivers innovative solutions that exceed expectations. The LA7668N falls under the category of Other Function Consumer ICs, offering versatility and reliability in various applications. With a power supply of 5V and 24 terminals, this product is designed to meet the demands of modern electronics. Trust Onsemi to provide you with the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable and long-lasting.

Package Shape: RECTANGULAR

Sleek and compact design allows for easy integration into various electronic devices.

Power Supplies (V): 5

Operates at a standard voltage level, making it compatible with a wide range of electronic systems.

No. of Terminals: 24

Sufficient number of terminals for versatile connectivity options.

Maximum Operating Temperature: 65 °C

Can withstand high operating temperatures, suitable for different environments.

Minimum Operating Temperature: -10 °C

Can operate in low-temperature conditions, providing flexibility in usage.

Technology: BIPOLAR

Utilizes bipolar technology for efficient performance and reliability.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections and ease of soldering during assembly.

Technical Specifications

Other Function Consumer ICs LA7668N attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LA7668N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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