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LA6245P

Onsemi

LA6245P by Onsemi

LA6245P by Onsemi is a Motion Control IC with 44 terminals, operating at -40 to 85 °C. It has a supply voltage of 8V and max current of 45mA. Ideal for industrial applications requiring precise motion control in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,268 parts In-Stock

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Digiode

USA . 1,158 parts In-Stock

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TANS Electronics

Latvia . 6,208 parts In-Stock

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Problanco Electronics

Mexico . 6,153 parts In-Stock

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Kulean Microsystems

USA . 3,907 parts In-Stock

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SupplyDigital Components

Austria . 3,039 parts In-Stock

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Corphita

USA . 1,004 parts In-Stock

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UHIMA Technologies

Türkiye . 646 parts In-Stock

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646

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Corohmni

South Africa . 316 parts In-Stock

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Overview

Elevate your motion control applications with the LA6245P by Onsemi. Crafted with precision and expertise, this high-quality IC offers unparalleled performance and reliability. From robotics to automated machinery, this product is designed to optimize efficiency and enhance functionality. Experience seamless operation and superior control with Onsemi's cutting-edge technology. Unlock endless possibilities and elevate your projects with the LA6245P.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Easy to mount on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 8 V

Operates efficiently at a standard voltage, making it compatible with a wide range of systems.

No. of Terminals: 44

Offers versatility in connecting various external components for versatile motion control applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with varying heat levels.

Maximum Supply Current (Isup): 45 mA

Operates at a low current, conserving energy and reducing electricity costs.

Technology: BIPOLAR

Delivers accurate and precise control over motion, ensuring smooth operation of connected devices.

Terminal Pitch: 0.8 mm

Provides compatibility with standard PCB layouts, simplifying the integration process.

Technical Specifications

Motion Control ICs LA6245P attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G44

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

8

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

45 mA

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LA6245P Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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