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LA6242H-TRM-E

Onsemi

LA6242H-TRM-E by Onsemi

LA6242H-TRM-E by Onsemi is a Motion Control IC with 36 terminals, operating at -40 to 85 °C. It has a supply voltage of 8V and max current of 45mA. Ideal for industrial applications requiring bipolar technology in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 9,150 parts In-Stock

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Digiode

USA . 2,094 parts In-Stock

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AZTECH Wire

Italy . 682 parts In-Stock

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$9.070

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682

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QUARKTWIN TECHNOLOGY LTD

USA . 21,617 parts In-Stock

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Metaverse IC Inc.

Canada . 12,992 parts In-Stock

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Assy Fe

Spain . 11,000 parts In-Stock

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Kepictronics

USA . 10,992 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Kulean Microsystems

USA . 4,118 parts In-Stock

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Problanco Electronics

Mexico . 3,691 parts In-Stock

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TANS Electronics

Latvia . 2,583 parts In-Stock

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SupplyDigital Components

Austria . 2,453 parts In-Stock

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Corphita

USA . 2,321 parts In-Stock

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UHIMA Technologies

Türkiye . 729 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 217 parts In-Stock

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Overview

The LA6242H-TRM-E by Onsemi is a top-of-the-line Motion Control IC, known for its superior quality and reliability. As a trusted manufacturer in the industry, Onsemi delivers cutting-edge solutions that exceed expectations. This high-performance IC offers exceptional value and benefits to customers, providing precise motion control in a wide range of applications. Whether you're looking to optimize efficiency, enhance functionality, or improve performance, the LA6242H-TRM-E has got you covered. Upgrade your projects with this innovative product and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort in the assembly process.

Nominal Supply Voltage (Vsup): 8 V

The nominal supply voltage of 8V provides a stable power source for the motion control IC, ensuring reliable performance in various operating conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this motion control IC can withstand high temperatures, making it suitable for industrial applications where heat dissipation is critical.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that this product has a moderate level of moisture sensitivity, allowing it to be stored and used in environments with moderate humidity levels without risk of damage.

Technical Specifications

Motion Control ICs LA6242H-TRM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

45 mA

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA6242H-TRM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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