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LA5744TP-FA-E

Onsemi

LA5744TP-FA-E by Onsemi

LA5744TP-FA-E by Onsemi is a 5-terminal switching regulator with max output current of 1.5A and max operating temp of 125 °C. Ideal for voltage-mode control applications, it operates at a frequency of up to 360 kHz in plastic/epoxy package suitable for surface mount assembly.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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AZTECH Wire

Italy . 515 parts In-Stock

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Component Stockers USA

USA . 396 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 5,578 parts In-Stock

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Problanco Electronics

Mexico . 4,511 parts In-Stock

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Microchip USA

USA . 3,955 parts In-Stock

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Kulean Microsystems

USA . 3,176 parts In-Stock

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TANS Electronics

Latvia . 1,163 parts In-Stock

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UHIMA Technologies

Türkiye . 557 parts In-Stock

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Corohmni

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Corphita

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Overview

Discover the innovative LA5744TP-FA-E by Onsemi, a high-quality switching regulator and controller designed to meet your power management needs with precision. Onsemi, known for its reliable products, delivers exceptional performance in this category, offering customers peace of mind and superior results. Ideal for a variety of applications, this product provides valuable benefits such as efficiency, stability, and flexibility. Elevate your projects with the LA5744TP-FA-E and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to high temperatures, making this product suitable for various environments.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

No. of Terminals: 5

Having 5 terminals allows for multiple connections, enabling flexibility in circuit design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand tough operating conditions without compromising performance.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides precise regulation of output voltage, ensuring stable and efficient operation.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows this product to function reliably even in cold environments.

Terminal Finish: TIN BISMUTH

Terminal finish of TIN BISMUTH ensures good conductivity and solderability, enhancing the overall reliability of the product.

Terminal Position: SINGLE

Single terminal position simplifies installation and improves ease of use.

Maximum Switching Frequency: 360 kHz

High maximum switching frequency results in fast response times and efficient power conversion.

Maximum Output Current: 1.5 A

With a maximum output current of 1.5 A, this product can deliver sufficient power for various applications.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27 mm enables compact design and space-saving on the PCB.

Technical Specifications

Switching Regulators & Controllers LA5744TP-FA-E attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-609 Code:

e6

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.37,50TB

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

360 kHz

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Trade Compliance

LA5744TP-FA-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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