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LA5724M-TE-L-E

Onsemi

LA5724M-TE-L-E by Onsemi

LA5724M-TE-L-E by Onsemi is a voltage-mode switching regulator with 8 terminals, operating b/w -30 °C to 125°C. It features a max switching frequency of 192 kHz and uses tin/bismuth terminal finish. This small outline package is ideal for various applications requiring efficient power control in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,083 parts In-Stock

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Digiode

USA . 1,350 parts In-Stock

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1,350

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Distributors (Availability)

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AZTECH Wire

Italy . 923 parts In-Stock

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$9.910

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923

$9.910

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QUARKTWIN TECHNOLOGY LTD

USA . 9,379 parts In-Stock

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TANS Electronics

Latvia . 7,464 parts In-Stock

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Problanco Electronics

Mexico . 7,069 parts In-Stock

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7,069

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Microchip USA

USA . 6,069 parts In-Stock

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6,069

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Kulean Microsystems

USA . 5,625 parts In-Stock

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5,625

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SupplyDigital Components

Austria . 4,940 parts In-Stock

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Assy Fe

Spain . 3,240 parts In-Stock

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Metaverse IC Inc.

Canada . 1,230 parts In-Stock

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Corohmni

South Africa . 376 parts In-Stock

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376

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Corphita

USA . 244 parts In-Stock

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UHIMA Technologies

Türkiye . 81 parts In-Stock

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Overview

Experience the cutting-edge technology of the LA5724M-TE-L-E by Onsemi, a top-tier manufacturer known for delivering high-quality switching regulators and controllers. Perfect for a wide range of applications, this product offers exceptional value with its advanced features and reliable performance. With a maximum operating temperature of 125 °C and a minimum operating temperature of -30°C, this device provides optimal control mode with a voltage-mode setting and a maximum switching frequency of 192 kHz. Trust Onsemi to deliver top-notch products that exceed expectations and bring unparalleled benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the product is lightweight and durable, making it easy to handle and resistant to damage.

Surface Mount: YES

Being surface mount allows for easy and convenient installation on PCBs, saving space and making the product suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular shape of the package provides stability and ease of placement on the circuit board, ensuring reliable performance.

No. of Terminals: 8

Having 8 terminals allows for more versatile connections and configurations, enhancing the product's functionality and compatibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for applications where board real estate is limited.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding environments, increasing the product's versatility.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage, ensuring stable and efficient operation of the switching regulator or controller.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for operation in colder environments, making the product suitable for a wide range of applications.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides corrosion resistance and reliable soldering connections, enhancing the product's durability and longevity.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in board layout and easier integration into various circuit designs, improving the product's versatility.

Maximum Switching Frequency: 192 kHz

The high maximum switching frequency enables efficient power conversion and minimizes noise interference, enhancing the product's performance.

Terminal Form: GULL WING

The gull wing terminal form provides added mechanical strength and secure solder joints, ensuring reliable connections and long-term stability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and easy alignment during assembly, promoting efficient manufacturing processes and high-quality connections.

Technical Specifications

Switching Regulators & Controllers LA5724M-TE-L-E attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

192 kHz

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LA5724M-TE-L-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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