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LA5735M

Onsemi

LA5735M by Onsemi

LA5735M by Onsemi is a voltage-mode switching regulator with max output current of 0.3A and max operating temp of 125 °C. Its small outline package shape, surface mount feature, and dual terminal position make it ideal for various applications in electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,174 parts In-Stock

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Vyrian

USA . 149 parts In-Stock

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149

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Kulean Microsystems

USA . 8,133 parts In-Stock

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Problanco Electronics

Mexico . 5,455 parts In-Stock

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TANS Electronics

Latvia . 3,705 parts In-Stock

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SupplyDigital Components

Austria . 3,004 parts In-Stock

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Corphita

USA . 1,235 parts In-Stock

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UHIMA Technologies

Türkiye . 490 parts In-Stock

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490

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Corohmni

South Africa . 303 parts In-Stock

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Overview

Unleash the power of innovation with the LA5735M by Onsemi. As a leader in the industry, Onsemi's commitment to quality shines through in this cutting-edge Switching Regulator & Controller. Perfect for a wide range of applications, this small outline package offers maximum performance and efficiency with a voltage-mode control mode and a high switching frequency of 360 kHz. Experience the benefits of superior design and functionality, all while enjoying the peace of mind that comes with choosing a trusted manufacturer like Onsemi. Elevate your projects with the LA5735M today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product into circuit boards, saving space and making assembly more efficient.

Package Shape: RECTANGULAR

The rectangular shape allows for easier placement and alignment on a circuit board, enabling better organization and space utilization.

No. of Terminals: 8

Having 8 terminals provides flexibility in connection options and allows for multiple inputs and outputs, making it suitable for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact designs or applications with limited space.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can perform reliably even in demanding environments with elevated temperatures.

Control Mode: VOLTAGE-MODE

The voltage-mode control mode offers precise regulation and stability in voltage output, making it suitable for applications requiring consistent power delivery.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for use in cold environments without sacrificing performance or reliability.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connection options, ensuring robustness and ease of integration into different systems.

Maximum Switching Frequency: 360 kHz

The high maximum switching frequency allows for fast response and high efficiency in power conversion, making it suitable for demanding applications.

Maximum Output Current: 0.3 A

The maximum output current of 0.3A ensures that the product can deliver sufficient power for various loads, making it versatile and applicable in different scenarios.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, reducing the risk of disconnection or signal interference, enhancing overall performance.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise positioning and alignment during assembly, ensuring proper connection and minimizing the risk of errors or malfunctions.

Technical Specifications

Switching Regulators & Controllers LA5735M attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

360 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LA5735M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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