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LA5735MC-AH

Onsemi

LA5735MC-AH by Onsemi

LA5735MC-AH by Onsemi is a voltage-mode switching regulator with max. operating temp of 125 °C and max. switching frequency of 360 kHz. Ideal for applications requiring precise voltage control in a small outline package, it operates b/w -30°C to 125°C, making it suitable for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 27,000 parts In-Stock

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Vyrian

USA . 6,393 parts In-Stock

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Digiode

USA . 1,581 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 851 parts In-Stock

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Bristol Electronics

USA . 851 parts In-Stock

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Dan-Mar Components

USA . 851 parts In-Stock

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Ampacity Inc.

Singapore . 719 parts In-Stock

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$2.500

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719

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AZTECH Wire

Italy . 1,170 parts In-Stock

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$18.900

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Component Stockers USA

USA . 335 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,230 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,364 parts In-Stock

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Problanco Electronics

Mexico . 5,669 parts In-Stock

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Kulean Microsystems

USA . 5,342 parts In-Stock

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TANS Electronics

Latvia . 5,269 parts In-Stock

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Microchip USA

USA . 4,276 parts In-Stock

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Corphita

USA . 1,330 parts In-Stock

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UHIMA Technologies

Türkiye . 631 parts In-Stock

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Corohmni

South Africa . 243 parts In-Stock

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Overview

Discover the innovative LA5735MC-AH by Onsemi, a cutting-edge switching regulator and controller that offers top-notch quality and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is designed to meet the highest standards and deliver exceptional performance. Ideal for a wide range of applications, this small outline package with 8 terminals provides efficient voltage control and operates smoothly in temperatures ranging from -30 °C to 125°C. With a maximum switching frequency of 360 kHz and dual terminal position, the LA5735MC-AH guarantees optimal functionality and longevity. Upgrade your systems with this advanced solution and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is cost-effective and durable, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, reducing production time and costs.

Package Shape: RECTANGULAR

Rectangular package shape saves space on the PCB, making it suitable for compact designs.

No. of Terminals: 8

Having 8 terminals provides flexibility in connection options and enables the regulator to handle multiple functions efficiently.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces the overall size of the component, ideal for designs where space is limited.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the regulator can operate reliably under varying environmental conditions.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise voltage regulation, ensuring stability and efficiency in power delivery.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the regulator to function effectively even in cold environments.

Terminal Finish: TIN

Tin terminal finish protects against corrosion and ensures good electrical conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves electrical contact, enhancing the regulator's overall performance.

Maximum Switching Frequency: 360 kHz

High switching frequency enables fast response times and efficient power conversion, improving overall system reliability.

Terminal Form: GULL WING

Gull wing terminal form is ideal for surface mount applications, ensuring secure connections and ease of soldering.

Terminal Pitch: 1.27 mm

With a small terminal pitch, the regulator can be placed closer together on the PCB, saving space and improving layout flexibility.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product can withstand exposure to moderate levels of moisture during storage and assembly processes.

Technical Specifications

Switching Regulators & Controllers LA5735MC-AH attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

360 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA5735MC-AH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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