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J113RL

Onsemi

J113RL by Onsemi

J113RL by Onsemi is a N-CHANNEL FET with 100 ohm RDS(on) and 5 pF Crss. Ideal for CHOPPER applications, it operates in DEPLETION MODE at up to 150 °C. The THROUGH-HOLE package has a CYLINDRICAL shape with TIN LEAD finish, making it suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,573 parts In-Stock

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Vyrian

USA . 1,146 parts In-Stock

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Problanco Electronics

Mexico . 7,398 parts In-Stock

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TANS Electronics

Latvia . 5,588 parts In-Stock

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SupplyDigital Components

Austria . 3,915 parts In-Stock

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Corphita

USA . 1,658 parts In-Stock

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Kulean Microsystems

USA . 509 parts In-Stock

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UHIMA Technologies

Türkiye . 344 parts In-Stock

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Corohmni

South Africa . 186 parts In-Stock

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Overview

Unleash the power of innovation with the J113RL Small Signal Field Effect Transistor by Onsemi. Designed to deliver high-quality performance, this N-CHANNEL transistor is a game-changer in the world of electronics. Whether you're working on a chopper circuit or any other project requiring precision and reliability, this product offers unmatched value and benefits. Trust in Onsemi's reputation for excellence and elevate your designs with the J113RL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher electron mobility, making them suitable for high-performance applications.

Configuration: SINGLE

Single configuration simplifies circuit design and layout, making it easier to integrate the transistor into electronic systems.

Transistor Application: CHOPPER

Designed specifically for chopper applications, this transistor can efficiently switch high currents with minimal power loss.

Package Shape: ROUND

The round package shape allows for easy mounting and soldering, making it convenient for assembly and installation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and mechanical stability, ensuring reliable performance in demanding environments.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for simple biasing and control, making the transistor ideal for applications requiring high voltage handling.

No. of Terminals: 3

Having 3 terminals allows for flexibility in circuit connections and usage, enabling versatile applications.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers compact size and efficient heat dissipation, making it suitable for space-constrained environments.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high input impedance and low output impedance, resulting in efficient signal switching and amplification.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high thermal loads and operate reliably in demanding temperature conditions.

Transistor Element Material: SILICON

Silicon material offers excellent electronic properties, such as high thermal conductivity and low energy loss, ensuring high performance and reliability.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections and long-term stability.

Maximum Drain-Source On Resistance: 100 ohm

The low on-resistance of 100 ohms minimizes power loss and improves efficiency in applications where high current switching is required.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering, allowing for efficient assembly and maintenance.

Maximum Feedback Capacitance (Crss): 5 pF

The low feedback capacitance of 5 pF reduces signal distortion and improves high-frequency performance, making it suitable for fast-switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) J113RL attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Maximum Drain-Source On Resistance:

100 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

CHOPPER

Transistor Element Material:

SILICON

Trade Compliance

J113RL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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