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J112RL1G

Onsemi

J112RL1G by Onsemi

J112RL1G by Onsemi is a N-CHANNEL FET with 3 terminals and 0.4W power dissipation. Ideal for chopper applications, it operates in depletion mode with max drain-source resistance of 50 ohm. Its cylindrical package body is made of plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,224 parts In-Stock

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Digiode

USA . 1,010 parts In-Stock

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AZTECH Wire

Italy . 136 parts In-Stock

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$17.590

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QUARKTWIN TECHNOLOGY LTD

USA . 13,016 parts In-Stock

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Problanco Electronics

Mexico . 7,447 parts In-Stock

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TANS Electronics

Latvia . 3,192 parts In-Stock

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SupplyDigital Components

Austria . 2,837 parts In-Stock

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Corohmni

South Africa . 484 parts In-Stock

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UHIMA Technologies

Türkiye . 423 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 11 parts In-Stock

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Overview

Enhance your electronic designs with the J112RL1G from Onsemi, a top-tier manufacturer known for delivering high-quality components. As a small signal field effect transistor, this N-channel device offers exceptional performance and reliability in chopper applications. With its single configuration and depletion mode operation, the J112RL1G provides efficient power dissipation and precise control. Whether you're working on audio amplifiers, signal processing circuits, or voltage regulators, this transistor's low drain-source resistance and minimal feedback capacitance ensure optimal functionality. Trust Onsemi to deliver cutting-edge technology that elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for easy integration with other N-channel components in the circuit.

Configuration: SINGLE

Simplified design and installation process for circuitry.

Transistor Application: CHOPPER

Specifically designed for use in chopper circuits, ensuring optimized performance in that application.

Package Shape: ROUND

Facilitates easy mounting and installation in round holes or fixtures.

Terminal Form: THROUGH-HOLE

Allows for easy soldering onto a circuit board, ensuring secure connections.

Operating Mode: DEPLETION MODE

Offers flexibility and control in circuit operation.

No. of Terminals: 3

Simple and straightforward connectivity for circuit integration.

Maximum Power Dissipation (Abs): 0.4 W

Efficient power handling capacity for various applications.

Package Style: CYLINDRICAL

Space-efficient design for compact circuit layouts.

Field Effect Transistor Technology: JUNCTION

Provides reliable and consistent performance in junction-based applications.

Maximum Operating Temperature: 150 °C

Suitable for high-temperature environments, ensuring stable operation.

Transistor Element Material: SILICON

High-quality material for reliable transistor performance.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-term reliability.

Maximum Drain-Source On Resistance: 50 ohm

Low resistance for efficient signal transfer and power handling.

Terminal Position: BOTTOM

Easily accessible terminals for quick and secure connections.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow processes during manufacturing.

Maximum Feedback Capacitance (Crss): 5 pF

Low feedback capacitance for stable and reliable circuit performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) J112RL1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Maximum Drain-Source On Resistance:

50 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

CHOPPER

Transistor Element Material:

SILICON

Trade Compliance

J112RL1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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