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HUF75639G3

Onsemi

HUF75639G3 by Onsemi

HUF75639G3 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 56A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a max power dissipation of 200W and can withstand temperatures up to 175°C.

Median Price

$4.460

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 409 parts In-Stock

1+ parts

$3.550

100+ parts

$1.750

1k+ parts

$1.470

10k+ parts

-

409

$3.550

$1.750

$1.470

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Mouser Electronics

USA . 799 parts In-Stock

1+ parts

$4.460

100+ parts

-

1k+ parts

$1.810

10k+ parts

-

799

$4.460

-

$1.810

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DigiKey

USA . 295 parts In-Stock

1+ parts

$4.460

100+ parts

$2.470

1k+ parts

$1.710

10k+ parts

$1.567

295

$4.460

$2.470

$1.710

$1.567

Newark

USA . 378 parts In-Stock

1+ parts

$5.090

100+ parts

$2.690

1k+ parts

$2.550

10k+ parts

-

378

$5.090

$2.690

$2.550

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Element14

Singapore . 409 parts In-Stock

1+ parts

$6.060

100+ parts

$2.660

1k+ parts

$2.280

10k+ parts

-

409

$6.060

$2.660

$2.280

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Verical

USA . 30,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.577

10k+ parts

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30,600

-

-

$1.577

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Rochester

USA . 925 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.400

10k+ parts

$1.320

925

-

$1.570

$1.400

$1.320

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 146 parts In-Stock

1+ parts

$2.307

100+ parts

$1.811

1k+ parts

$1.515

10k+ parts

-

146

$2.307

$1.811

$1.515

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Digiode

USA . 1,618 parts In-Stock

1+ parts

$3.354

100+ parts

-

1k+ parts

-

10k+ parts

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1,618

$3.354

-

-

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Vyrian

USA . 2,160 parts In-Stock

1+ parts

$3.531

100+ parts

-

1k+ parts

-

10k+ parts

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2,160

$3.531

-

-

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Flip Electronics

USA . 30,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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30,600

-

-

-

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Freddi Giovanni

Italy . 930 parts In-Stock

1+ parts

-

100+ parts

-

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930

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Electronics Depot

USA . 126 parts In-Stock

1+ parts

-

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126

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Sea View Technologies

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

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10

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-

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MISTER SPROCKETS

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

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5

-

-

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Bristol Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

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5

-

-

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LWI Electronics Inc

India . 4 parts In-Stock

1+ parts

-

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-

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$0.527

100+ parts

$0.480

1k+ parts

$0.432

10k+ parts

-

150

$0.527

$0.480

$0.432

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Corphita

USA . 369 parts In-Stock

1+ parts

$3.178

100+ parts

-

1k+ parts

-

10k+ parts

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369

$3.178

-

-

-

Component Stockers USA

USA . 667 parts In-Stock

1+ parts

$3.260

100+ parts

$2.210

1k+ parts

-

10k+ parts

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667

$3.260

$2.210

-

-

Continental Prestige Electronics

USA . 155 parts In-Stock

1+ parts

$3.280

100+ parts

$1.680

1k+ parts

$1.520

10k+ parts

-

155

$3.280

$1.680

$1.520

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Corohmni

South Africa . 222 parts In-Stock

1+ parts

$3.531

100+ parts

-

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222

$3.531

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

USA . 35,544 parts In-Stock

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35,544

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QUARKTWIN TECHNOLOGY LTD

USA . 28,979 parts In-Stock

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28,979

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Lixinc

USA . 9,307 parts In-Stock

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9,307

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Microchip USA

USA . 6,548 parts In-Stock

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6,548

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Supply Digital

USA . 3,641 parts In-Stock

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3,641

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Problanco Electronics

Mexico . 3,351 parts In-Stock

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3,351

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SupplyDigital Components

Austria . 3,026 parts In-Stock

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3,026

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Kulean Microsystems

USA . 1,848 parts In-Stock

1+ parts

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1,848

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TANS Electronics

Latvia . 545 parts In-Stock

1+ parts

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545

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Kepictronics

USA . 500 parts In-Stock

1+ parts

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500

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UHIMA Technologies

Türkiye . 452 parts In-Stock

1+ parts

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452

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Assy Fe

Spain . 60 parts In-Stock

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60

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Overview

Unlock the power of the HUF75639G3 by Onsemi, a top-quality Power Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by Onsemi, a renowned leader in semiconductor technology, this N-CHANNEL transistor with a built-in diode is perfect for switching applications. With a maximum drain current of 56A and a low on-resistance of 0.025 ohms, this transistor delivers exceptional efficiency and power handling capabilities. Trust Onsemi's expertise and invest in the HUF75639G3 for all your high-power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of current, making it suitable for various switching applications.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage levels, making it suitable for power switching applications.

Maximum Drain Current (Abs) (ID): 56 A

Capable of handling high current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 200 W

Can dissipate a high amount of power, making it reliable for continuous operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Ensures efficient power handling and switching capabilities.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Maximum Drain-Source On Resistance: 0.025 ohm

Low on-resistance leads to minimal power loss and efficient switching, making it ideal for power applications.

Technical Specifications

Power Field Effect Transistors (FET) HUF75639G3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

56 A

Maximum Drain Current (ID):

56 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

HUF75639G3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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