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FST3126DTR2G

Onsemi

FST3126DTR2G by Onsemi

FST3126DTR2G by Onsemi is a 4-function bus driver with a supply voltage of 5V, operating temperature range of -55 to 125 °C, and propagation delay of 0.25ns. It is ideal for military-grade applications requiring true output polarity and 3-state output characteristics in a compact package style.

Median Price

$0.222

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

$0.231

1k+ parts

$0.192

10k+ parts

$0.171

2,740

-

$0.231

$0.192

$0.171

Verical

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.214

2,740

-

-

-

$0.214

Distributors (In-Stock)

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Digiode

USA . 772 parts In-Stock

1+ parts

$0.180

100+ parts

-

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772

$0.180

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Vyrian

USA . 3,497 parts In-Stock

1+ parts

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3,497

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 392 parts In-Stock

1+ parts

$0.170

100+ parts

-

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392

$0.170

-

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Corphita

USA . 1,787 parts In-Stock

1+ parts

$0.171

100+ parts

-

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1,787

$0.171

-

-

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Native Components

USA . 558 parts In-Stock

1+ parts

$0.622

100+ parts

-

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558

$0.622

-

-

-

Northwest PG Solutions

USA . 1,875 parts In-Stock

1+ parts

$0.684

100+ parts

-

1k+ parts

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1,875

$0.684

-

-

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AZTECH Wire

Italy . 1,166 parts In-Stock

1+ parts

$13.330

100+ parts

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1,166

$13.330

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TANS Electronics

Latvia . 7,236 parts In-Stock

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7,236

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SupplyDigital Components

Austria . 6,511 parts In-Stock

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6,511

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Problanco Electronics

Mexico . 5,559 parts In-Stock

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5,559

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Kulean Microsystems

USA . 3,439 parts In-Stock

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3,439

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Continental Prestige Electronics

USA . 2,740 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.170

10k+ parts

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2,740

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$0.170

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UHIMA Technologies

Türkiye . 549 parts In-Stock

1+ parts

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549

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Microchip USA

USA . 218 parts In-Stock

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218

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Overview

Discover the FST3126DTR2G by Onsemi, a top-quality bus driver & transceiver offering unparalleled performance and reliability. With its advanced technology and military-grade temperature grade, this product is perfect for a wide range of applications. From industrial automation to telecommunications, the FST3126DTR2G provides customers with a compact design, low power consumption, and fast propagation delay, making it a valuable addition to any project. Trust Onsemi's reputation for excellence and elevate your designs with the FST3126DTR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer durability and resistance to environmental factors, making this product suitable for a variety of operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space.

No. of Functions: 4

With multiple functions in a single package, this product offers versatility and efficiency in controlling and managing data transmission.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with common electronic systems and offers stable performance.

Width: 4.4 mm

Compact width of 4.4mm allows for space-saving integration in tight circuit board layouts.

Technology: CMOS

CMOS technology ensures low power consumption and fast operation, making this product efficient and reliable for data transmission.

Technical Specifications

Bus Driver & Transceivers FST3126DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

FST3126DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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