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FST3244MTCX

Onsemi

FST3244MTCX by Onsemi

FST3244MTCX by Onsemi is a 2-function bus driver/transceiver with 4 bits. It operates at a nominal voltage of 5V and has a propagation delay of 0.25ns. Ideal for industrial applications requiring true output polarity and a small outline package style.

Median Price

$0.273

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 24 parts In-Stock

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$0.273

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24

$0.273

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DigiKey

USA . 529,035 parts In-Stock

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$0.330

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529,035

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$0.330

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Chip1Stop

Japan . 24 parts In-Stock

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24

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Verical

USA . 24 parts In-Stock

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$0.268

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$0.268

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Digiode

USA . 741 parts In-Stock

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$0.094

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741

$0.094

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Vyrian

USA . 1,709 parts In-Stock

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$0.104

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DigiKey Marketplace

USA . 529,035 parts In-Stock

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529,035

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Chip Stock

USA . 9,671 parts In-Stock

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Legend Electronics Inc.

USA . 2,420 parts In-Stock

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Prism Electronics

USA . 1,584 parts In-Stock

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Semi Source

USA . 308 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,871 parts In-Stock

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$0.089

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1,871

$0.089

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Corohmni

South Africa . 472 parts In-Stock

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$0.104

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472

$0.104

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Andel Nordic

Denmark . 500 parts In-Stock

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$10.181

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$9.774

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$9.774

500

$10.181

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$9.774

$9.774

Continental Prestige Electronics

USA . 536,063 parts In-Stock

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$0.380

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536,063

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$0.380

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Kepictronics

USA . 58,135 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,389 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,584 parts In-Stock

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Kulean Microsystems

USA . 5,979 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,389 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Microchip USA

USA . 3,475 parts In-Stock

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SupplyDigital Components

Austria . 3,016 parts In-Stock

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TANS Electronics

Latvia . 3,004 parts In-Stock

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Problanco Electronics

Mexico . 2,880 parts In-Stock

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Supply Digital

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Northwest PG Solutions

USA . 1,982 parts In-Stock

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 860 parts In-Stock

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Native Components

USA . 112 parts In-Stock

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Overview

Experience seamless communication and enhanced performance with the FST3244MTCX by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. Ideal for Bus Driver & Transceivers applications, this versatile device offers customers unparalleled value and benefits. Say goodbye to connectivity issues and hello to smooth data transmission with the FST3244MTCX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package, ensuring reliability in various operating conditions.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Offers multiple functions in a single component, increasing efficiency and reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient performance and power consumption.

Propagation Delay (tpd): 0.25 ns

Provides fast signal transmission, minimizing delays in communication within the system.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range, ensuring reliability in harsh environments.

Technical Specifications

Bus Driver & Transceivers FST3244MTCX attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

TTL COMPATIBLE BUS SWITCH

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

FST3244MTCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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