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FST3126DR2G

Onsemi

FST3126DR2G by Onsemi

FST3126DR2G by Onsemi is a 4-function bus driver with 3-STATE output, operating at a supply voltage range of 4V to 5.5V. It features a low propagation delay of 0.25ns and can withstand temperatures from -55 °C to 125°C. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.249

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,160 parts In-Stock

1+ parts

$0.480

100+ parts

$0.263

1k+ parts

$0.223

10k+ parts

-

2,160

$0.480

$0.263

$0.223

-

Rochester

USA . 32,807 parts In-Stock

1+ parts

-

100+ parts

$0.249

1k+ parts

$0.207

10k+ parts

$0.184

32,807

-

$0.249

$0.207

$0.184

Verical

USA . 30,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.230

30,367

-

-

-

$0.230

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 531 parts In-Stock

1+ parts

$0.194

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$0.194

-

-

-

Vyrian

USA . 1,622 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

-

1,622

$0.200

-

-

-

Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,488 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

10k+ parts

-

2,488

$0.184

-

-

-

Component Stockers USA

USA . 5,039 parts In-Stock

1+ parts

$0.210

100+ parts

$0.200

1k+ parts

$0.180

10k+ parts

-

5,039

$0.210

$0.200

$0.180

-

Corohmni

South Africa . 128 parts In-Stock

1+ parts

$0.265

100+ parts

-

1k+ parts

-

10k+ parts

-

128

$0.265

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$37.718

100+ parts

$34.323

1k+ parts

$30.929

10k+ parts

-

100

$37.718

$34.323

$30.929

-

A-Z Elektronik GmbH

Germany . 7,302 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,302

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-

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SupplyDigital Components

Austria . 6,277 parts In-Stock

1+ parts

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6,277

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Kulean Microsystems

USA . 5,244 parts In-Stock

1+ parts

-

100+ parts

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5,244

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Alle Elektronik GmbH

Germany . 4,868 parts In-Stock

1+ parts

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4,868

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

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TANS Electronics

Latvia . 2,764 parts In-Stock

1+ parts

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2,764

-

-

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Problanco Electronics

Mexico . 2,287 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,287

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UHIMA Technologies

Türkiye . 689 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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689

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Native Components

USA . 439 parts In-Stock

1+ parts

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439

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Microchip USA

USA . 352 parts In-Stock

1+ parts

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352

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Northwest PG Solutions

USA . 119 parts In-Stock

1+ parts

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119

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Overview

Enhance your electronic designs with the FST3126DR2G by Onsemi, a top-tier manufacturer known for reliable and high-quality components. This bus driver & transceiver offers unparalleled performance and versatility, making it ideal for a wide range of applications. With a compact design and advanced features such as 3-STATE output characteristics, this product delivers exceptional value and benefits to customers looking to optimize their systems. Trust Onsemi to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the FST3126DR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for rugged environments and portable applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and equipment.

Propagation Delay (tpd): 0.25 ns

Low propagation delay of 0.25 nanoseconds ensures fast signal transmission, making the product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand harsh environmental conditions without compromising performance.

Width: 3.9 mm

Compact width of 3.9mm allows for space-efficient integration into electronic devices, ideal for designs with limited board space.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability and performance in extreme temperature conditions, making the product suitable for military and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Technical Specifications

Bus Driver & Transceivers FST3126DR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FST3126DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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