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FST3253MTC

Onsemi

FST3253MTC by Onsemi

FST3253MTC by Onsemi is a bus driver & transceiver with 2 functions, 0.25 ns propagation delay, and 50 pF load capacitance. It is used in industrial applications for true output polarity control at temperatures ranging from -40 to 85 °C.

Median Price

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Lifecycle Status

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10

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1k+

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Chip Stock

USA . 74,000 parts In-Stock

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Digiode

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Speed Components Ltd

Israel . 619 parts In-Stock

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BCID Electronics Ltd.

Israel . 533 parts In-Stock

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

France . 94 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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Native Components

USA . 787 parts In-Stock

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$15.676

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Northwest PG Solutions

USA . 500 parts In-Stock

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$17.244

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$15.520

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Andel Nordic

Denmark . 343 parts In-Stock

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$57.630

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QUARKTWIN TECHNOLOGY LTD

USA . 23,465 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 7,302 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

Germany . 4,742 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Problanco Electronics

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Alle Elektronik GmbH

Germany . 3,161 parts In-Stock

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Metaverse IC Inc.

Canada . 1,575 parts In-Stock

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Corphita

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UHIMA Technologies

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Overview

Enhance your electronic designs with the FST3253MTC by Onsemi, a top-quality bus driver & transceiver that offers superior performance and reliability. Manufactured by Onsemi, a trusted industry leader, this product is perfect for a wide range of applications. With its fast propagation delay, small outline package, and true output polarity, you can trust this product to deliver exceptional results. Experience the value and benefits of the FST3253MTC today and take your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for varied operating conditions.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast and efficient communication, making this product ideal for applications requiring quick data transmission.

Surface Mount: YES

The surface mount feature makes installation easy and saves space, making it suitable for compact designs and applications with limited space.

No. of Functions: 2

Having multiple functions in one device saves cost and space, making it a versatile solution for different applications.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a commonly used supply voltage, ensuring compatibility with various systems and reducing the need for additional components for voltage regulation.

Technical Specifications

Bus Driver & Transceivers FST3253MTC attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

2

No. of Ports:

5

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

FST3253MTC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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