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FSB50250B

Onsemi

FSB50250B by Onsemi

FSB50250B by Onsemi is a Motion Control IC with 23 terminals, operating voltage range of 13.5V to 16.5V, and max output current of 5A. Ideal for automotive applications, this hybrid technology IC features a rectangular package style and temperature grade suitable for harsh environments.

Median Price

$6.060

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 252 parts In-Stock

1+ parts

$5.180

100+ parts

$2.930

1k+ parts

$2.870

10k+ parts

-

252

$5.180

$2.930

$2.870

-

Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$6.940

100+ parts

$5.310

1k+ parts

$5.300

10k+ parts

$4.190

260

$6.940

$5.310

$5.300

$4.190

Element14

Singapore . 252 parts In-Stock

1+ parts

$9.920

100+ parts

$7.590

1k+ parts

$7.580

10k+ parts

-

252

$9.920

$7.590

$7.580

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DigiKey

USA . 270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.590

10k+ parts

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270

-

-

$3.590

-

Flip Electronics (Authorized)

USA . 270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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270

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,295 parts In-Stock

1+ parts

$3.667

100+ parts

-

1k+ parts

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10k+ parts

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2,295

$3.667

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-

-

Chip Stock

USA . 37,000 parts In-Stock

1+ parts

-

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37,000

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-

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Vyrian

USA . 13,124 parts In-Stock

1+ parts

-

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13,124

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Flip Electronics

USA . 270 parts In-Stock

1+ parts

-

100+ parts

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270

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-

-

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ACDS - Activité Composants Distribution Service

France . 230 parts In-Stock

1+ parts

-

100+ parts

-

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230

-

-

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Bristol Electronics

USA . 230 parts In-Stock

1+ parts

-

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230

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Dan-Mar Components

USA . 230 parts In-Stock

1+ parts

-

100+ parts

-

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230

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 363 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

-

10k+ parts

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363

$2.450

-

-

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Corphita

USA . 780 parts In-Stock

1+ parts

$3.474

100+ parts

-

1k+ parts

-

10k+ parts

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780

$3.474

-

-

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Corohmni

South Africa . 280 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

10k+ parts

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280

$3.860

-

-

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Native Components

USA . 817 parts In-Stock

1+ parts

$5.595

100+ parts

-

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817

$5.595

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 16,506 parts In-Stock

1+ parts

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16,506

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Kulean Microsystems

USA . 7,731 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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7,731

-

-

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TANS Electronics

Latvia . 2,146 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,146

-

-

-

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Problanco Electronics

Mexico . 1,960 parts In-Stock

1+ parts

-

100+ parts

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1,960

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-

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Northwest PG Solutions

USA . 1,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.483

10k+ parts

-

1,659

-

-

$5.483

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SupplyDigital Components

Austria . 1,649 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,649

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-

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UHIMA Technologies

Türkiye . 504 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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504

-

-

-

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Overview

Discover the power of motion control with the FSB50250B by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability in the realm of motion control ICs. Perfect for a wide range of applications, from automotive to industrial settings, this brushless DC motor controller is designed to enhance efficiency and precision in your projects. With a sleek design and advanced technology, the FSB50250B delivers unbeatable value and benefits to customers looking to elevate their motion control systems. Experience the difference with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular packages are commonly used in motion control ICs as they provide efficient use of space and easy mounting on circuit boards.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15 V ensures stable operation of the motion control IC, providing a reliable power source for controlling brushless DC motors.

No. of Terminals: 23

Having 23 terminals allows for versatile connectivity options, enabling the IC to interface with various sensors and other components in a motion control system.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand harsh environmental conditions, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the IC can function reliably even in cold environments, adding to its versatility.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, while the annealed process ensures durability and reliability of the terminal connections.

Maximum Output Current: 5 A

With a maximum output current of 5 A, this motion control IC can effectively drive brushless DC motors with high power requirements, making it suitable for a wide range of applications.

Technology: HYBRID

Hybrid technology combines the benefits of different manufacturing processes, providing a balance of performance, reliability, and cost-effectiveness in the motion control IC.

Maximum Supply Voltage (Vsup): 16.5 V

The higher maximum supply voltage of 16.5 V provides a margin of safety for the IC, ensuring it can handle voltage fluctuations without compromising its performance.

Technical Specifications

Motion Control ICs FSB50250B attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-XDMA-T23

JESD-609 Code:

e3

Length:

29 mm

No. of Functions:

1

No. of Terminals:

23

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

3.3 mm

Maximum Supply Current (Isup):

.9 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

12 mm

Trade Compliance

FSB50250B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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