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FSA550UCX

Onsemi

FSA550UCX by Onsemi

FSA550UCX by Onsemi is a 4-channel multiplexer with a very thin profile and fine pitch. It operates in industrial temperature range (-40 to 85 °C) with a max supply voltage of 3V. With a low on-state resistance of 0.8 ohm, it is ideal for applications requiring high-speed switching and separate output control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 3,300 parts In-Stock

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Vyrian

USA . 1,890 parts In-Stock

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Digiode

USA . 1,526 parts In-Stock

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Northwest PG Solutions

USA . 654 parts In-Stock

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Perfect Parts

USA . 30,240 parts In-Stock

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SupplyDigital Components

Austria . 7,367 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,957 parts In-Stock

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Kulean Microsystems

USA . 5,063 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 3,971 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,520 parts In-Stock

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UHIMA Technologies

Türkiye . 873 parts In-Stock

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Problanco Electronics

Mexico . 822 parts In-Stock

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Native Components

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Supply Digital

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Microchip USA

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Corphita

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Corohmni

South Africa . 227 parts In-Stock

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Overview

Upgrade your electronic systems with the FSA550UCX by Onsemi, a high-quality multiplexer and switch designed to meet your diverse application needs. With a focus on reliability and performance, Onsemi ensures that each component is manufactured to the highest standards, providing seamless integration into your projects. From consumer electronics to industrial automation, this versatile product offers value, benefits, and advantages that will elevate your designs to the next level. Experience the difference with Onsemi's FSA550UCX today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

The ability to be surface-mounted allows for easy and efficient installation on circuit boards.

Power Supplies (V): GND/3

The product can operate with a ground and up to 3 volts, making it versatile for various power supply configurations.

No. of Terminals: 12

Having 12 terminals allows for multiple connections to be made, extending the functionality of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without issues.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish ensures good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to connect the product within circuits and reduces the risk of interference.

Maximum On-state Resistance (Ron): 0.8 ohm

The low on-state resistance of 0.8 ohms minimizes power loss and improves signal transmission efficiency.

Maximum Switch-on Time: 120 ns

The fast switch-on time of 120 nanoseconds ensures quick response and seamless operation of the product.

Technical Specifications

Multiplexers & Switches FSA550UCX attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B12

JESD-609 Code:

e1

Length:

1.56 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NC

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

12

Nominal Off-state Isolation:

90 dB

Maximum On-state Resistance (Ron):

.8 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

GND/3

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.6 V

Surface Mount:

YES

Maximum Switch-on Time:

120 ns

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.16 mm

Trade Compliance

FSA550UCX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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