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FSA550BUCX

Onsemi

FSA550BUCX by Onsemi

FSA550BUCX by Onsemi is a 4-channel multiplexer with a max on-state resistance of 0.8 ohm and a normal position voltage of NC. It operates in industrial temperature grade range from -40 to 85 °C, making it suitable for various switching applications requiring high isolation levels up to 90 dB. The package style is grid array with very thin profile and fine pitch, ideal for compact designs where space is limited.

Median Price

$2.546

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,000 parts In-Stock

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$0.782

100+ parts

$0.493

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3,000

$0.782

$0.493

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Arrow

USA . 3,000 parts In-Stock

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$4.310

100+ parts

$3.830

1k+ parts

$3.660

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3,000

$4.310

$3.830

$3.660

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Verical

USA . 3,000 parts In-Stock

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Digiode

USA . 2,906 parts In-Stock

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$0.521

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2,906

$0.521

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Vyrian

USA . 2,567 parts In-Stock

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2,567

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Cyclops Electronics Ltd

UK . 990 parts In-Stock

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990

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,606 parts In-Stock

1+ parts

$0.400

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2,606

$0.400

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Corohmni

South Africa . 375 parts In-Stock

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$0.471

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375

$0.471

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Corphita

USA . 1,691 parts In-Stock

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$0.493

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1,691

$0.493

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Component Stockers USA

USA . 8,776 parts In-Stock

1+ parts

$0.910

100+ parts

$0.740

1k+ parts

$0.620

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8,776

$0.910

$0.740

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Microchip USA

USA . 140 parts In-Stock

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$3.713

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Perfect Parts

USA . 23,789 parts In-Stock

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Lixinc

USA . 17,766 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 7,015 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,231 parts In-Stock

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Kulean Microsystems

USA . 6,191 parts In-Stock

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TANS Electronics

Latvia . 5,102 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,154 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Problanco Electronics

Mexico . 2,472 parts In-Stock

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Supply Digital

USA . 2,459 parts In-Stock

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iodParts Technologies Inc.

India . 990 parts In-Stock

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990

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UHIMA Technologies

Türkiye . 272 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience seamless and reliable performance with the FSA550BUCX by Onsemi. This top-notch multiplexer switch offers unparalleled quality and precision, making it ideal for a wide range of applications. With its innovative design and advanced technology, this product provides exceptional value and benefits to customers looking for superior functionality and efficiency. Trust Onsemi to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the FSA550BUCX and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and lightweight construction for the product.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards.

Package Shape: RECTANGULAR

Offers a standard shape for easy integration into various systems.

Power Supplies (V): GND/3

Supports a range of power supplies for flexibility in usage.

No. of Terminals: 12

Provides multiple connection points for increased functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables a compact design and precise component placement.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ideal for diverse operating conditions.

Terminal Finish: TIN SILVER COPPER

Offers a corrosion-resistant finish for long-lasting use.

Terminal Position: BOTTOM

Simplifies connection and installation processes.

Output (V): SEPARATE OUTPUT

Provides separate output channels for enhanced signal control.

Maximum Seated Height: 0.625 mm

Enables a low-profile design for space-efficient installations.

Width (mm): 1.16 mm

Compact width for integration in tight spaces.

Other IC type: 4PST

Supports multiple poles for versatile switching applications.

Minimum Supply Voltage (Vsup): 1.6 V

Compatible with a wide range of supply voltage levels.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper reflow processes during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high temperatures during assembly.

Maximum On-state Resistance (Ron): 0.8 ohm

Low resistance for efficient signal transmission.

Maximum Switch-on Time: 120 ns

Provides quick response times for fast switching operations.

Length: 1.56 mm

Compact length for space-saving installations.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements for reliable performance.

No. of Channels: 4

Multiple channels for versatile signal routing options.

Terminal Form: BALL

Ball terminals for secure connections.

Terminal Pitch: 0.4 mm

Fine pitch for precise component placement.

Maximum Supply Voltage (Vsup): 3 V

Supports a high supply voltage for powerful operations.

Normal Position (V): NC

Normal closed position for default signal routing.

Nominal Off-state Isolation: 90 dB

High isolation for clean signal transmission.

Technical Specifications

Multiplexers & Switches FSA550BUCX attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B12

JESD-609 Code:

e1

Length:

1.56 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NC

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

12

Nominal Off-state Isolation:

90 dB

Maximum On-state Resistance (Ron):

.8 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

GND/3

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.6 V

Surface Mount:

YES

Maximum Switch-on Time:

120 ns

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.16 mm

Trade Compliance

FSA550BUCX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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