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FQH44N10-133

Onsemi

FQH44N10-133 by Onsemi

FQH44N10-133 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 48A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 192A Pulsed Drain Current, and 0.039 ohm On Resistance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,163 parts In-Stock

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Vyrian

USA . 149 parts In-Stock

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Native Components

USA . 527 parts In-Stock

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$0.591

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Northwest PG Solutions

USA . 1,944 parts In-Stock

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$0.650

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Kulean Microsystems

USA . 6,717 parts In-Stock

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SupplyDigital Components

Austria . 6,213 parts In-Stock

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TANS Electronics

Latvia . 4,109 parts In-Stock

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Problanco Electronics

Mexico . 1,277 parts In-Stock

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Corohmni

South Africa . 257 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 170 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the FQH44N10-133 Power FET. This N-channel transistor offers superior performance in switching applications, making it the ideal choice for your power management needs. With a high operating temperature range and low on-resistance, this transistor provides exceptional value and efficiency. Trust Onsemi to deliver cutting-edge technology and innovation for all your electronic components. Elevate your projects with the FQH44N10-133 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to high temperatures, making the product sturdy and able to withstand demanding operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, leading to better performance and efficiency in switching applications.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle high voltages safely, making it suitable for applications requiring robust voltage protection.

Maximum Power Dissipation (Abs): 180 W

This FET can handle high power dissipation, ensuring reliable operation even under heavy load conditions.

Maximum Drain Current (ID): 48 A

The high drain current capability allows the FET to effectively handle large current loads, making it versatile for various switching applications.

Maximum Drain-Source On Resistance: 0.039 ohm

Low on-resistance results in minimal power loss and increased efficiency, making this FET suitable for high-performance switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FQH44N10-133 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

530 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

48 A

Maximum Drain Current (ID):

48 A

Maximum Drain-Source On Resistance:

.039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

110 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

400 ns

Maximum Turn On Time (ton):

435 ns

Trade Compliance

FQH44N10-133 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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