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FQH44N10-F133

Onsemi

FQH44N10-F133 by Onsemi

FQH44N10-F133 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, 192A IDM, and 0.039 ohm RDS(on). Ideal for SWITCHING applications due to its 180W Pdiss, EAS of 530mJ, and -55 to +175°C operating temp. Suitable for various power control circuits.

Median Price

$1.430

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

$1.430

100+ parts

$1.340

1k+ parts

$1.210

10k+ parts

-

10

$1.430

$1.340

$1.210

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,880 parts In-Stock

1+ parts

$1.358

100+ parts

-

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1,880

$1.358

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Nova Conductors

Japan . 1,300 parts In-Stock

1+ parts

$1.822

100+ parts

-

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1,300

$1.822

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Flip Electronics

USA . 9,000 parts In-Stock

1+ parts

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9,000

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Vyrian

USA . 5,601 parts In-Stock

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-

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5,601

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Distributors (Availability)

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Ampacity Inc.

Singapore . 20 parts In-Stock

1+ parts

$1.220

100+ parts

-

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20

$1.220

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Corphita

USA . 2,317 parts In-Stock

1+ parts

$1.287

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-

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2,317

$1.287

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Corohmni

South Africa . 474 parts In-Stock

1+ parts

$1.430

100+ parts

-

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474

$1.430

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Modulus Dynamics

Lithuania . 22,573 parts In-Stock

1+ parts

$1.558

100+ parts

$1.558

1k+ parts

$1.558

10k+ parts

-

22,573

$1.558

$1.558

$1.558

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Bastille Electronics

Australia . 650 parts In-Stock

1+ parts

$1.822

100+ parts

$1.731

1k+ parts

$1.644

10k+ parts

$1.622

650

$1.822

$1.731

$1.644

$1.622

Continental Prestige Electronics

USA . 7,725 parts In-Stock

1+ parts

$1.822

100+ parts

-

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$1.786

7,725

$1.822

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-

$1.786

Argo Parts USA

USA . 7,332 parts In-Stock

1+ parts

$1.822

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7,332

$1.822

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Aztec Data Supply Inc.

USA . 1,464 parts In-Stock

1+ parts

$1.860

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1,464

$1.860

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AZTECH Wire

Italy . 1,171 parts In-Stock

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$17.304

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$17.304

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Problanco Electronics

Mexico . 5,039 parts In-Stock

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5,039

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SupplyDigital Components

Austria . 3,133 parts In-Stock

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3,133

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Kulean Microsystems

USA . 3,001 parts In-Stock

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TANS Electronics

Latvia . 2,707 parts In-Stock

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2,707

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,008 parts In-Stock

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1,008

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Supply Digital

USA . 980 parts In-Stock

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980

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UHIMA Technologies

Türkiye . 540 parts In-Stock

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540

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Kepictronics

USA . 450 parts In-Stock

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450

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Overview

Upgrade your power systems with the FQH44N10-F133 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. The FQH44N10-F133 falls under the Power Field Effect Transistors (FET) category and is perfect for switching applications. With a single configuration and built-in diode, this transistor offers enhanced performance and efficiency. Experience the benefits of its 100V minimum DS breakdown voltage, 192A maximum pulsed drain current, and 530mJ avalanche energy rating. Trust Onsemi to deliver cutting-edge technology that meets your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the FET lightweight and durable, ideal for use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a good choice for power applications.

Minimum DS Breakdown Voltage: 100 V

With a high minimum breakdown voltage, this FET can handle high voltages without breakdown, ensuring reliable operation in power circuits.

Maximum Drain Current (ID): 48 A

The high maximum drain current rating allows the FET to handle large currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 180 W

The high power dissipation rating of 180 W enables the FET to dissipate heat efficiently, making it dependable for continuous operation at high power levels.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology provides high efficiency and fast switching speeds, making this FET suitable for switching applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175°C, this FET can withstand elevated temperatures, ensuring reliable operation in challenging environments.

Technical Specifications

Power Field Effect Transistors (FET) FQH44N10-F133 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

530 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

48 A

Maximum Drain Current (ID):

48 A

Maximum Drain-Source On Resistance:

.039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQH44N10-F133 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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