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FQD6N50C

Onsemi

FQD6N50C by Onsemi

FQD6N50C by Onsemi is a N-CHANNEL Power FET with 500V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 18A IDM and 1.2ohm RDS(on). The transistor operates in ENHANCEMENT MODE with a max temp of 150 °C, making it suitable for various power control systems.

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 2,642 parts In-Stock

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Digiode

USA . 1,293 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 86 parts In-Stock

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Andel Nordic

Denmark . 50 parts In-Stock

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$10.690

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$10.262

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,823 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,882 parts In-Stock

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SupplyDigital Components

Austria . 2,792 parts In-Stock

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Corphita

USA . 2,625 parts In-Stock

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Kulean Microsystems

USA . 2,453 parts In-Stock

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Supply Digital

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Problanco Electronics

Mexico . 1,331 parts In-Stock

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Native Components

USA . 968 parts In-Stock

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TANS Electronics

Latvia . 866 parts In-Stock

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Northwest PG Solutions

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Corohmni

South Africa . 382 parts In-Stock

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UHIMA Technologies

Türkiye . 109 parts In-Stock

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Overview

Elevate your power management solutions with the FQD6N50C by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance and reliability for switching applications. Its single configuration with a built-in diode ensures seamless operation, while the high DS breakdown voltage of 500V provides added protection. Experience enhanced efficiency and durability with the FQD6N50C, designed to meet your power needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation, protection, and durability for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this product a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protects the transistor from reverse currents, enhancing its overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in tasks that require frequent on/off switching.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 500 V

High breakdown voltage provides robust protection against voltage spikes and overloads, increasing the reliability and longevity of the transistor.

Maximum Pulsed Drain Current (IDM): 18 A

Capable of handling high pulsed currents, making it suitable for applications that require short-duration power bursts.

Avalanche Energy Rating (EAS): 300 mJ

The high Avalanche Energy Rating ensures the transistor can withstand high-energy spikes without damage, enhancing its reliability in harsh operating conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can perform reliably in a wide range of temperature environments.

Maximum Drain-Source On Resistance: 1.2 ohm

Low on-resistance results in minimal power loss and high efficiency during operation, making it an excellent choice for power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FQD6N50C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQD6N50C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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