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FQD3P50TM-F085

Onsemi

FQD3P50TM-F085 by Onsemi

FQD3P50TM-F085 by Onsemi is a P-CHANNEL Power FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features 8.4A Max Pulsed Drain Current, 250mJ Avalanche Energy Rating, and 4.9 ohm Max Drain-Source Resistance. Operating in ENHANCEMENT MODE, it has a max power dissipation of 50W and can withstand temperatures up to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 5,962 parts In-Stock

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Flip Electronics

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Digiode

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Nova Conductors

Japan . 586 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 323 parts In-Stock

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$0.569

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323

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AZTECH Wire

Italy . 1,284 parts In-Stock

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$7.796

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Ampacity Inc.

Singapore . 1,002 parts In-Stock

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$24.050

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$24.050

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Semicontronic

India . 1,115 parts In-Stock

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$27.050

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$26.374

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$26.238

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Lixinc

USA . 10,325 parts In-Stock

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Continental Prestige Electronics

USA . 10,160 parts In-Stock

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Problanco Electronics

Mexico . 5,940 parts In-Stock

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Argo Parts USA

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SupplyDigital Components

Austria . 3,249 parts In-Stock

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Supply Digital

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TANS Electronics

Latvia . 1,292 parts In-Stock

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Corphita

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Robosynatics

Brazil . 950 parts In-Stock

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$10.348

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$10.348

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Lucentia Tech

USA . 950 parts In-Stock

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$10.348

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$10.348

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Bastille Electronics

Australia . 750 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 428 parts In-Stock

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Kulean Microsystems

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Advanced Electronics

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Corohmni

South Africa . 52 parts In-Stock

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Overview

Upgrade your power systems with the FQD3P50TM-F085 from Onsemi. As a leading manufacturer in power field effect transistors, Onsemi delivers quality and reliability in every product. This P-channel transistor with a built-in diode is perfect for switching applications, offering enhanced performance and efficiency. With a high breakdown voltage of 500V and maximum power dissipation of 50W, this transistor ensures optimal functionality even under demanding conditions. Trust Onsemi for cutting-edge technology and superior products that provide unmatched value and benefits for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and insulation, making the product durable and reliable.

Polarity or Channel Type: P-CHANNEL

Allows for efficient power switching and control in certain applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified circuit design and saves space with the built-in diode.

Transistor Application: SWITCHING

Optimized for high-speed switching applications.

Surface Mount: YES

Easily mountable on circuit boards for convenience and space-saving.

Minimum DS Breakdown Voltage: 500 V

Can handle high voltage applications with a safety margin.

Package Shape: RECTANGULAR

Compact shape for efficient placement on a PCB.

Terminal Form: GULL WING

Designed for easy soldering onto PCBs.

Operating Mode: ENHANCEMENT MODE

Allows for easy control and operation in various applications.

Maximum Pulsed Drain Current (IDM): 8.4 A

Capable of handling sudden spikes in current for reliable performance.

Avalanche Energy Rating (EAS): 250 mJ

Can withstand energy spikes and prevent damage to the transistor.

Maximum Drain Current (Abs) (ID): 2.1 A

Sufficient current-carrying capacity for many applications.

Maximum Power Dissipation (Abs): 50 W

Can handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Compact size for efficient use of space on a PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and efficiency for switching applications.

Maximum Operating Temperature: 150 °C

Can operate reliably even in high-temperature environments.

Transistor Element Material: SILICON

Provides good electrical properties and reliability.

Maximum Turn On Time (ton): 155 ns

Fast turn-on time for quick response in switching operations.

Minimum Operating Temperature: -55 °C

Operational in low-temperature conditions as well.

Maximum Turn Off Time (toff): 180 ns

Ensures rapid turn-off for efficient switching.

Terminal Finish: Matte Tin (Sn) - annealed

Provides good solderability and electrical conductivity.

Maximum Drain-Source On Resistance: 4.9 ohm

Low resistance for efficient power transfer.

Terminal Position: SINGLE

Simplified connections for ease of use.

Case Connection: DRAIN

Common connection point for easy integration into circuits.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during soldering process.

Peak Reflow Temperature °C: 260

Optimum soldering temperature to ensure proper connections.

Maximum Feedback Capacitance (Crss): 12 pF

Low feedback capacitance for better performance in high-frequency applications.

Reference Standard: AEC-Q101

Complies with automotive electronics quality standards for reliability.

Technical Specifications

Power Field Effect Transistors (FET) FQD3P50TM-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

250 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

2.1 A

Maximum Drain Current (ID):

2.1 A

Maximum Drain-Source On Resistance:

4.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

8.4 A

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

180 ns

Maximum Turn On Time (ton):

155 ns

Trade Compliance

FQD3P50TM-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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