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FQB34N20L

Onsemi

FQB34N20L by Onsemi

FQB34N20L by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max IDM of 124A and EAS of 640mJ, this ENHANCEMENT MODE transistor has 0.08 ohm RDS(on) and operates up to 150 °C. Perfect for high-power switching needs in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 13,187 parts In-Stock

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Vyrian

USA . 1,820 parts In-Stock

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Digiode

USA . 1,301 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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Native Components

USA . 186 parts In-Stock

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$1.995

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Northwest PG Solutions

USA . 2,204 parts In-Stock

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$2.194

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Andel Nordic

Denmark . 270 parts In-Stock

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$4.259

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$4.088

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$4.088

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$4.088

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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SupplyDigital Components

Austria . 7,512 parts In-Stock

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Kulean Microsystems

USA . 6,766 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,182 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,121 parts In-Stock

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TANS Electronics

Latvia . 3,547 parts In-Stock

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Problanco Electronics

Mexico . 3,529 parts In-Stock

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Supply Digital

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Corphita

USA . 1,342 parts In-Stock

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Corohmni

South Africa . 428 parts In-Stock

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UHIMA Technologies

Türkiye . 36 parts In-Stock

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Overview

Enhance your power switching capabilities with the FQB34N20L by Onsemi. Crafted with precision and expertise, this N-channel Power Field Effect Transistor boasts a single configuration with a built-in diode, making it ideal for a variety of switching applications. With a maximum drain current of 31A and a low on-resistance of 0.08 ohm, this transistor delivers reliable performance and efficiency. Trust in the quality and innovation of Onsemi to bring you cutting-edge technology that exceeds expectations. Empower your projects with the FQB34N20L and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and operation in a specific direction.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by eliminating the need for an external diode.

Transistor Application: SWITCHING

Designed specifically for fast switching applications, ensuring high performance.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 200 V

Can handle high voltage levels, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

Allows for compact placement on circuit boards, optimizing space utilization.

Terminal Form: GULL WING

Facilitates easy soldering and secure connection during installation.

Operating Mode: ENHANCEMENT MODE

Provides efficient control of current flow, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 124 A

Handles high current spikes effectively, ensuring reliable operation during peak loads.

Avalanche Energy Rating (EAS): 640 mJ

Capable of withstanding energy spikes, making it suitable for rugged applications.

No. of Terminals: 2

Simplifies circuit connection and reduces complexity in circuit design.

Package Style (Meter): SMALL OUTLINE

Ideal for space-constrained applications, offering a compact form factor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Ensures efficient operation and high performance of the FET.

Maximum Operating Temperature: 150 °C

Capable of operating in high-temperature environments, ensuring reliability under varying conditions.

Transistor Element Material: SILICON

Provides consistent and reliable performance, offering longevity to the FET.

Maximum Drain Current (ID): 31 A

Can handle high continuous current levels, suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.08 ohm

Offers low resistance for efficient current flow and reduced power loss.

Terminal Position: SINGLE

Simplifies installation and connection process, ensuring ease of use.

Case Connection: DRAIN

Facilitates easy connection to the circuit, ensuring reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) FQB34N20L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING, AVALANCHE RATED

Avalanche Energy Rating (EAS):

640 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

31 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

124 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB34N20L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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