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FPF1504UCX

Onsemi

FPF1504UCX by Onsemi

Onsemi's FPF1504UCX is a Power Management IC with 3.3V supply voltage, suitable for industrial applications. It features a very thin profile grid array package with 4 terminals and operates b/w -40 to 85°C. The IC supports power supply circuits and has a terminal pitch of 0.5mm, making it ideal for compact designs.

Median Price

$0.288

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 53 parts In-Stock

1+ parts

$0.374

100+ parts

$0.215

1k+ parts

$0.189

10k+ parts

$0.178

53

$0.374

$0.215

$0.189

$0.178

Mouser Electronics

USA . 3,000 parts In-Stock

1+ parts

$0.430

100+ parts

$0.231

1k+ parts

$0.204

10k+ parts

$0.183

3,000

$0.430

$0.231

$0.204

$0.183

DigiKey

USA . 315 parts In-Stock

1+ parts

$0.430

100+ parts

$0.231

1k+ parts

$0.214

10k+ parts

-

315

$0.430

$0.231

$0.214

-

Newark

USA . 125 parts In-Stock

1+ parts

$0.443

100+ parts

$0.237

1k+ parts

-

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125

$0.443

$0.237

-

-

Rochester

USA . 1,070,882 parts In-Stock

1+ parts

-

100+ parts

$0.217

1k+ parts

$0.180

10k+ parts

$0.160

1,070,882

-

$0.217

$0.180

$0.160

Verical

USA . 838,490 parts In-Stock

1+ parts

-

100+ parts

-

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$0.200

838,490

-

-

-

$0.200

Flip Electronics (Authorized)

USA . 303,000 parts In-Stock

1+ parts

-

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-

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303,000

-

-

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Farnell

UK . 6,040 parts In-Stock

1+ parts

-

100+ parts

$0.292

1k+ parts

$0.205

10k+ parts

$0.202

6,040

-

$0.292

$0.205

$0.202

Element14

Singapore . 6,040 parts In-Stock

1+ parts

-

100+ parts

$0.283

1k+ parts

$0.211

10k+ parts

$0.204

6,040

-

$0.283

$0.211

$0.204

Future Electronics

Canada . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.161

6,000

-

-

-

$0.161

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.173

3,000

-

-

-

$0.173

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,404 parts In-Stock

1+ parts

$0.116

100+ parts

-

1k+ parts

-

10k+ parts

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2,404

$0.116

-

-

-

Flip Electronics

USA . 303,000 parts In-Stock

1+ parts

-

100+ parts

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303,000

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Vyrian

USA . 130,810 parts In-Stock

1+ parts

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130,810

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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$0.300

6,000

-

-

-

$0.300

IBS Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.226

6,000

-

-

-

$0.226

Sensible Micro Corp

USA . 5,891 parts In-Stock

1+ parts

-

100+ parts

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5,891

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-

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Netsource Technology, Inc.

USA . 2,324 parts In-Stock

1+ parts

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2,324

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Prism Electronics

USA . 56 parts In-Stock

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56

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Nova Conductors

Japan . 36 parts In-Stock

1+ parts

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36

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 130,394 parts In-Stock

1+ parts

$0.047

100+ parts

$0.046

1k+ parts

$0.046

10k+ parts

-

130,394

$0.047

$0.046

$0.046

-

Ampacity Inc.

Singapore . 130,975 parts In-Stock

1+ parts

$0.104

100+ parts

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130,975

$0.104

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Corphita

USA . 3,073 parts In-Stock

1+ parts

$0.110

100+ parts

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3,073

$0.110

-

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Corohmni

South Africa . 397 parts In-Stock

1+ parts

$0.122

100+ parts

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397

$0.122

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Continental Prestige Electronics

USA . 6,655 parts In-Stock

1+ parts

$0.397

100+ parts

$0.250

1k+ parts

$0.149

10k+ parts

$0.143

6,655

$0.397

$0.250

$0.149

$0.143

Aztec Data Supply Inc.

USA . 246 parts In-Stock

1+ parts

$2.393

100+ parts

-

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246

$2.393

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Authorized Procurement Solutions

USA . 50,000 parts In-Stock

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Metaverse IC Inc.

Canada . 36,800 parts In-Stock

1+ parts

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36,800

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GreenTree Electronics

Israel . 33,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,550 parts In-Stock

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Perfect Parts

USA . 16,800 parts In-Stock

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16,800

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Lixinc

USA . 11,222 parts In-Stock

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TANS Electronics

Latvia . 8,168 parts In-Stock

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8,168

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Kulean Microsystems

USA . 8,122 parts In-Stock

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8,122

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ChipstoGo Electronic ltd

UK . 8,100 parts In-Stock

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8,100

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Problanco Electronics

Mexico . 5,777 parts In-Stock

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5,777

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Microchip USA

USA . 5,717 parts In-Stock

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5,717

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Kepictronics

USA . 4,740 parts In-Stock

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4,740

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Supply Digital

USA . 2,573 parts In-Stock

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2,573

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SupplyDigital Components

Austria . 1,644 parts In-Stock

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1,644

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Argo Parts USA

USA . 437 parts In-Stock

1+ parts

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437

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UHIMA Technologies

Türkiye . 306 parts In-Stock

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306

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Bastille Electronics

Australia . 36 parts In-Stock

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36

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Overview

Discover the ultimate power management solution with the FPF1504UCX by Onsemi. With a cutting-edge design and high-quality materials, this Power Management IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product delivers superior efficiency and precision in managing power supply circuits. Say goodbye to power interruptions and hello to seamless operations with the FPF1504UCX. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes this product lightweight and durable, ideal for portable applications.

Surface Mount: YES

This product can be easily mounted on a PCB, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

With a nominal supply voltage of 3.3V, this product is compatible with a wide range of electronic devices.

No. of Terminals: 4

The 4 terminals provide efficient connectivity and allow for seamless integration into circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper enhances conductivity, ensuring optimal power management efficiency.

Maximum Seated Height: 0.625 mm

The compact maximum seated height of 0.625mm allows for a slim design and easy integration into tight spaces.

Width (mm): 0.96 mm

The width of 0.96mm makes this product suitable for compact electronic devices with limited space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC provides essential support for power supply circuits, ensuring stable and efficient power distribution.

Minimum Supply Voltage (Vsup): 1 V

With a minimum supply voltage of 1V, this product is versatile and can be used in a variety of applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30s ensures efficient soldering and secure connections during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can withstand high-temperature soldering processes without damage.

Length: 0.96 mm

The length of 0.96mm contributes to the overall compact size of this power management IC.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can handle demanding operating conditions with ease.

Technology: CMOS

The CMOS technology used in this IC ensures low power consumption and efficient performance.

Terminal Form: BALL

The ball terminal form provides reliable connections and enables easy installation.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product allows for precise and secure connections in tight spaces.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this IC can effectively manage higher power requirements in electronic systems.

Technical Specifications

Power Management ICs FPF1504UCX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

.96 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

.96 mm

Trade Compliance

FPF1504UCX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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