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FPF1504LUC

Onsemi

FPF1504LUC by Onsemi

FPF1504LUC by Onsemi is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It features a grid array package style, ultra-thin profile, and fine pitch terminals. With a temperature range of -40 to 85 °C, it supports power supply circuits efficiently in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,294 parts In-Stock

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2,294

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Vyrian

USA . 681 parts In-Stock

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681

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 284 parts In-Stock

1+ parts

$0.273

100+ parts

-

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$0.262

284

$0.273

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-

$0.262

Northwest PG Solutions

USA . 1,883 parts In-Stock

1+ parts

$0.300

100+ parts

-

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$0.264

1,883

$0.300

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$0.264

Problanco Electronics

Mexico . 8,103 parts In-Stock

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8,103

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Kulean Microsystems

USA . 4,972 parts In-Stock

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4,972

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TANS Electronics

Latvia . 3,890 parts In-Stock

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3,890

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Corphita

USA . 1,951 parts In-Stock

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1,951

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SupplyDigital Components

Austria . 929 parts In-Stock

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929

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UHIMA Technologies

Türkiye . 571 parts In-Stock

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571

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Corohmni

South Africa . 369 parts In-Stock

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369

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Overview

Experience the power of innovation with the FPF1504LUC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs designed for maximum efficiency and reliability. This versatile product is perfect for a wide range of applications, offering customers unmatched value and performance. With a compact design and industrial-grade temperature tolerance, the FPF1504LUC is the ideal choice for demanding power supply support circuits. Trust Onsemi to provide you with the best in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a lightweight and durable package, making this product ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto PCBs, saving time and cost in manufacturing.

Nominal Supply Voltage (Vsup): 3.3 V

Supports a common and widely used supply voltage, ensuring compatibility with a wide range of devices and systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments, making this power management IC suitable for a variety of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to efficient power management and reliable performance.

Technical Specifications

Power Management ICs FPF1504LUC attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B4

Length:

.96 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,16

Package Shape:

Package Style (Meter):

GRID ARRAY, ULTRA THIN PROFILE, FINE PITCH

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

.96 mm

Trade Compliance

FPF1504LUC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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